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Yamaha Robotics Debuts Award-winning Dual-lane Mounter and New Software at Productronica 2023

11/28/2023 | Yamaha Robotics
Yamaha Robotics has revealed the YRM20DL dual-lane mounter for the first time in Europe at Productronica 2023, and also introduced new features of its powerful smart-factory software tools.

$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US

11/27/2023 | PRNewswire
Micross Components, a leading provider of high-reliability microelectronic products and services for aerospace, defense, space, medical, energy, and other high-reliability applications, is pleased to announce that it has received an award under the IBAS Cornerstone RESHAPE program with a ceiling value of up to $134.3 million, with $45.6 million obligated at the time of the award.

ViTrox's Cutting-Edge V510i 3D AOI Wins the 2023 Global Technology Award, Redefining Inspection Excellence

11/23/2023 | ViTrox
The award was announced during the award ceremony at Productronica in Munich, Germany, on November 14, 2023.

IPC Applauds New U.S. Government Strategy for Advanced Packaging

11/22/2023 | IPC
The U.S. Government’s announcement of a national strategy for “advanced packaging” under the CHIPS for America Program is a big step toward ensuring the resiliency and security of the U.S. supply chain for advanced electronics.

Ansys Collaborates with TSMC and Microsoft to Accelerate Mechanical Stress Simulation for 3D-IC Reliability in the Cloud

11/20/2023 | ANSYS
Ansys has collaborated with TSMC and Microsoft  to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems manufactured with TSMC’s 3DFabric™ advanced packaging technologies.
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