Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
StenTech Discusses Revolution of Stencil Manufacturing with Laser Technology at SMTA Guadalajara
September 25, 2023 | StenTechEstimated reading time: 1 minute
StenTech Inc., the leading multinational SMT Printing Solutions company, is pleased to announce plans to exhibit at the SMTA Guadalajara Expo, scheduled to take place Oct. 25-26, 2023 at the Expo Guadalajara in Guadalajara, Jalisco, Mexico. This year's exhibition promises to be a game-changer as StenTech unveils its latest capabilities, including a state-of-the-art laser system and award-winning Advanced Nano Coating in Booth 920.
StenTech has raised the bar in the stencil manufacturing industry by making a substantial investment in the newest iteration of the StencilLaser G6080 from LPKF Laser & Electronics. This cutting-edge laser system represents a significant milestone for the SMT industry in Mexico, showcasing StenTech's unwavering commitment to its esteemed local customer base in Jalisco.
The StencilLaser G6080 stands as a flagship laser system, renowned for its best-in-class technology, tailored to meet the exacting demands of even the most discerning stencil users in the SMT industry. Distinguished by its custom carbon fiber architecture, this state-of-the-art laser system ensures superior positioning accuracy and sidewall quality while maximizing productivity. Versatile and adaptable, it is capable of cutting stainless steel and nickel stencils with material thicknesses ranging from 20 um to 1 mm (0.8 to 40 mil). StenTech's investment in this advanced laser technology empowers the company to deliver stencil solutions that consistently meet the highest industry standards.
In addition to its latest investment in state-of-the-art laser technology, StenTech's Guadalajara facility also offers an array of cutting-edge capabilities, including Advanced Nano Coating, tooling solutions, and unparalleled customer service. The combination of these advanced offerings positions StenTech as a trusted partner for the most demanding stencil projects, meeting the unique needs of its customers across various industries.
The Advanced Nano Coating features an exceptional 1-3 um hardened nano coating expertly applied to the bottom side and inside the apertures of the stencil. This cutting-edge technology offers remarkable anti-adhesion properties, effectively repelling solder flux and ensuring superior paste transfer.
By harnessing the power of StenTech's Advanced Nano Coating, transfer efficiency can soar by up to 25 percent, resulting in a substantial reduction in bridging and paste-related defects. The "non-stick" characteristics of the coating also lead to reduced underside cleaning, contributing to improved yields and decreased expenses on rework and touch-up. Additionally, stencils coated with Advanced Nano are ready for use just 30 minutes after coating, elevating production efficiency and minimizing downtime.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs: