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Three Things to Improve High-Speed PCB Signoff, Part 2
September 27, 2023 | Brad Griffin, Cadence Design SystemsEstimated reading time: 1 minute

Another challenge for SerDes is losses within the channel design. At high speeds, dielectric material can be very lossy, making the appropriate selection of the right material, length, etc., critical for the channel. Many questions about stackup, trace widths, and height from the ground plane need to be defined up front. Simulating a signal with a topology explorer tool extracted from the design can be used to set up and run sweep parameters and push min/max length/spacing values into the Allegro schematic constraint manager (system capture). The preliminary constraints and schematics flow is illustrated in Figure 1. As the design progresses with final decisions on stackup and material selections, these constraints can be adjusted.
With the schematics phase finished and the layout phase in progress, the next challenge is compliance with specifications. Specs are dependent on the technology—PCI Express (PCIe), USB, etc.—and, because each one has its own requirements, this can be a complicated process. During this analysis, it is important to make sure the correct transmitter and receiver IBIS-AMI models are being used.
For the channel, Cadence tools can be used to accurately model the channels and address specifications. This is done by using the board file created by the layout designer, selecting several or all the lanes (depending on how much time is available), and running either a 2.5D or full 3D analysis on the entire channel.
Using the results of the channel extraction, a compliance analysis can be run based on the desired protocol. Most likely this will not be a one-time event, as often some obscure requirement not identified in the preliminary phase will surface, requiring additional iterations.
To read the rest of this article, which appeared in the September 2023 issue of Design007 Magazine, click here.
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09/05/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
SRXGlobal Celebrates Inauguration of Johor Bahru Facility Expansion and Modernization
09/03/2025 | BUSINESS WIRESRXGlobal, a Scanfil company, is proud to announce the expansion and modernization of its facility in Johor Bahru, Malaysia.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
North American PCB Industry Shipments Up 20.7% in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00. Total North American PCB shipments in July 2025 were up 20.7% compared to the same month last year.