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The End of Solder?September 28, 2023 | Nolan Johnson, I-Connect007
Estimated reading time: Less than a minute
The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
When we talk about the CHIPS Act, that leads to a discussion about the assembly process, as they seem so interrelated.
Certainly. As the CHIPS Act money started rolling out last year, IPC hosted a conference in Washington, D.C. to point out that semiconductor chips do not exist in a vacuum; they are part of an electronics ecosystem that includes interconnection and protection. Therefore, U.S.-based packaging and assembly would be needed, alongside U.S. chip fabrication. This appeared to be news to many. The role of solder in advanced packaging has been changing over the years, but solder will continue to be needed.
To read this entire conversation, which appeared in the September 2023 issue of SMT007 Magazine, click here.
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona.
Keysight Technologies, Inc. announces that Arbe has selected the E8719A Radar Target Solution (RTS) to test the Arbe 4D imaging radar chipset for automotive applications.
Statement of Support from IPC for New Actions to Strengthen America’s Supply Chains, Lower Costs for Families, and Secure Key Sectors11/27/2023 | IPC
IPC welcomes the actions outlined today by the U.S. Government “to strengthen supply chains critical to America’s economic and national security.”
The U.S. Government’s announcement of a national strategy for “advanced packaging” under the CHIPS for America Program is a big step toward ensuring the resiliency and security of the U.S. supply chain for advanced electronics.
Keysight Technologies, Inc. has validated the first protocol conformance test case for 3rd Generation Partnership Project (3GPP) Release 17 (Rel-17) standards for non-terrestrial networks using narrowband internet of things (NB-IoT) technology.