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Amkor Announces US Advanced Packaging and Test Facility

12/05/2023 | Amkor Technology
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona.

Keysight Enables Validation of Arbe 4D Imaging Radar Chipset

11/30/2023 | Keysight Technologies, Inc.
Keysight Technologies, Inc. announces that Arbe has selected the E8719A Radar Target Solution (RTS) to test the Arbe 4D imaging radar chipset for automotive applications.

Statement of Support from IPC for New Actions to Strengthen America’s Supply Chains, Lower Costs for Families, and Secure Key Sectors

11/27/2023 | IPC
IPC welcomes the actions outlined today by the U.S. Government “to strengthen supply chains critical to America’s economic and national security.”

IPC Applauds New U.S. Government Strategy for Advanced Packaging

11/22/2023 | IPC
The U.S. Government’s announcement of a national strategy for “advanced packaging” under the CHIPS for America Program is a big step toward ensuring the resiliency and security of the U.S. supply chain for advanced electronics.

Keysight Validates First Test Case for 3GPP Release 17 Non-Terrestrial Networks Standard

11/09/2023 | Keysight Technologies, Inc.
Keysight Technologies, Inc. has validated the first protocol conformance test case for 3rd Generation Partnership Project (3GPP) Release 17 (Rel-17) standards for non-terrestrial networks using narrowband internet of things (NB-IoT) technology.
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