The Government Circuit: Support for Defense Spending Takes Top Priority
SMT Perspectives and Prospects: The AI Era, Part 3: LLMs, SLMs, and Foundation Models
Punching Out: What Buyers Are BuyingThe End of Solder?
September 28, 2023 | Nolan Johnson, I-Connect007Estimated reading time: Less than a minute
The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
When we talk about the CHIPS Act, that leads to a discussion about the assembly process, as they seem so interrelated.
Certainly. As the CHIPS Act money started rolling out last year, IPC hosted a conference in Washington, D.C. to point out that semiconductor chips do not exist in a vacuum; they are part of an electronics ecosystem that includes interconnection and protection. Therefore, U.S.-based packaging and assembly would be needed, alongside U.S. chip fabrication. This appeared to be news to many. The role of solder in advanced packaging has been changing over the years, but solder will continue to be needed.
To read this entire conversation, which appeared in the September 2023 issue of SMT007 Magazine, click here.
Share on:
Suggested Items
Iridium to Collaborate with Nordic Semiconductor on Iridium NTN Direct integration
10/11/2024 | PRNewswireIridium Communications Inc., a leading provider of global voice and data satellite communications, announced its collaboration with Nordic Semiconductor for early integration of its Iridium NTN Direct℠ service into Nordic's LTE-M/NB-IoT modules and chipsets.
CHIPS Act Falls Short Without Focus on Workforce Training
10/02/2024 | David Hernandez, VP of Education, IPCBillions of dollars of funding from the CHIPS and Science Act are going to the construction of new semiconductor fabrication plants (“fabs”). However, that investment will fail to meet its full potential unless we also focus on building something equally important: talent pipelines for the entire electronics manufacturing ecosystem.
NY CREATES Receives $4.7M National Science Foundation Grant to Launch Semiconductor Workforce Development Program
09/30/2024 | NY CREATESThe New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES) announced today it has been awarded a $4.7 million grant from the National Science Foundation (NSF) to support the establishment of the Education Alliance for Semiconductor Experiential Learning (EASEL) program.
SIA Applauds Finalization of First CHIPS Award for Polar Semiconductor
09/30/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the first finalized agreement to allocate incentives under the CHIPS and Science Act.
Biden-Harris Administration Announces First CHIPS Award to Polar Semiconductor, Establishing U.S. Foundry
09/25/2024 | NISTAs part of the Biden-Harris Administration’s Investing in America agenda, the U.S. Department of Commerce announced its first award under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities of up to $123 million in direct funding to Polar Semiconductor (Polar).