-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
KYZEN’s Debbie Carboni to Present in Panel Session at IPC High Reliability Forum
October 2, 2023 | KYZEN'Estimated reading time: 1 minute

KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, announced that Debbie Carboni, Global Product Line Manager - Electronics, will present as part of the Electric Vehicle (EV) panel during the IPC High Reliability Forum. The presentation entitled, “Revving Up Reliability: Connect, Clean and Cost for Electric Vehicle Excellence,” will take place Wednesday, Oct. 18, 2023, from 8:40 to 10:00 a.m. at the Hilton Baltimore BWI Airport in Linthicum, MD.
Carboni will be one of three presenters including Brian O’Leary of Indium and Brian Chislea of Dow. During the panel session, Carboni will represent KYZEN’s involvement in a collaborative study conducted with fellow industry leaders. She will offer insights to improve uptime performance to mitigate costly warranty repairs and enhance customer satisfaction.
The EV Panel session will focus on the resolution of durability concerns regarding PCBAs in e-Mobility infrastructure encompassing electric vehicles, charging stations, and Battery Energy Storage Systems. The overall goal of the session is to provide practical strategies for enhancing reliability in e-Mobility components and optimize overall user experience. The session will also consider assembly design challenges and offer solutions for constructing more dependable systems.
The IPC High Reliability Forum provides a unique opportunity for attendees to learn about the latest advancements in electronics, participate in industry discussions, and network within the respected community of professionals focused on electronics with high reliability requirements.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
SEL Showcases Global Factories and Product Development Journey for Manufacturing Day
10/10/2025 | SELSEL is celebrating Manufacturing Day 2025 with the release of a new video showcasing its product development and vertically integrated manufacturing process.
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.