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Global Sourcing Spotlight: Seven Key Challenges in Offshore Manufacturing

02/05/2025 | Bob Duke -- Column: Global Sourcing Spotlight
Offshore manufacturing has long been a strategy for companies seeking cost savings and access to specialized resources. However, it comes with a unique set of challenges that can complicate operations if not managed proactively. This month, we will examine the main difficulties of offshore manufacturing and offer advice on overcoming them for global success.

Indium Expert to Address Thermal Challenges at TestConX 2025

02/04/2025 | Indium Corporation
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.

Happy’s Tech Talk #37: New Ultra HDI Materials

02/03/2025 | Happy Holden -- Column: Happy’s Tech Talk
Some new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)

IPC Releases January 2025 Global Sentiment of the Electronics Manufacturing Supply Chain Report

01/28/2025 | IPC
Demand in the electronics industry recovered to 100 in December, marking the threshold between contraction and expansion after four consecutive months below this level according to IPC’s January Sentiment of the Global Electronics Manufacturing Supply Chain Report.

Delvitech Expands Into Microelectronics and Chiplet Segments

01/23/2025 | Delvitech
Delvitech, a global leader in AI-driven optical inspection technology, is proud to announce its strategic expansion into the microelectronics and chiplet sectors.
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