KIC Brings Innovative Solutions for Soldering and Curing Processes to productronica 2023

Estimated reading time: 1 minute

KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is thrilled to announce its participation in the upcoming productronica 2023. The event will take place on November 14-17, 2023, at the esteemed Trade Fair Center Messe München. Miles Moreau, General Manager, will be on-site in Hall A4, Stand 214 along with the KIC Europe team to engage with industry experts and engineering professionals, and discuss the latest developments and innovations.

At the event, KIC will highlight its groundbreaking advancements in process optimization and recipe refinement strategies as well as their latest state-of-the-art sensing technologies. These innovative solutions are designed to address challenges related to defects reduction, improved Overall Equipment Effectiveness (OEE), product quality, oven performance tracking, and innovative thermal profiling methodologies.

The dynamic landscape of electronics manufacturing, especially within the automotive, medical, and aerospace sector in Europe, demands intelligent utilization of extensive data to foster flexible, efficient, and successful manufacturing operations. KIC’s acclaimed "Heat to Data™" approach presents a comprehensive ecosystem encompassing all facets of electronics assembly and semiconductor packaging thermal processes. The company's solutions effectively tackle the challenges of temperature profiling, process setup, and inspection/monitoring, while also facilitating automation, traceability, and connectivity across diverse sectors including automotive, medical, aerospace, network, and military markets.