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VJ Electronix to Showcase Cutting-Edge Inspection Solutions at productronica 2023
October 12, 2023 | VJ ElectronixEstimated reading time: 1 minute

VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce plans to exhibit at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. VJ Electronix will showcase two groundbreaking systems, the Summit 2200i and the APOGEE 90, in Hall A2, Stand 117.
Summit 2200i: Precision and Automation Unleashed
The Summit 2200i represents a new era in high-precision, fully automatic systems for medium to large sized SMD (Surface Mount Device) assemblies. This cutting-edge system is engineered to handle boards up to 22"x30” and components as small as 01005 with utmost precision. What sets the Summit 2200i apart is its exceptional automation capabilities, which minimize operator intervention. Additionally, the system features automatic alignment, allowing for precise component alignment of components up to 100 mm square without the need for operator involvement. The Summit 2200i is poised to revolutionize SMD assembly processes by delivering unmatched accuracy and efficiency.
APOGEE 90: Superior Resolution and Affordability
The APOGEE 90 offers optimal performance and operability at a fraction of the cost of comparable X-ray inspection systems. Creatively designed with the superior resolution and automation typically found in higher cost systems, the APOGEE 90 is one of the most powerful and economical X-ray inspection systems on the market.
The microfocus X-ray inspection system is an advanced at-line NDT solution for manual (MXI) or semi-automated Inspection (AXI) of printed circuit boards, components and assemblies. The APOGEE 90 is equipped with a 90kV, sealed, microfocus X-ray source that can achieve a spot size as small as 4µm, a 5” HD Digital Flat Panel Detector with 85µm resolution, and 6-axis motorized motion control with oblique angle inspection of up to 45°.
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EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).