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Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
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Real Time with... SMTAI 2023: Adjusting to the Supply Chain
October 18, 2023 | Real Time with...SMTAIEstimated reading time: Less than a minute
Mark Ogden, ASMPT SMT Solutions' marketing manager for the Americas, discusses the unique challenges facing a build up of capacity in electronics manufacturing under these current supply chain conditions. Where is ASMPT putting their development attention for their customers? Find out here.
Suggested Items
ASMPT Presents Die Bonder with Intelligent Features
05/14/2025 | ASMPTASMPT, the leading supplier of production equipment for advanced packaging and semiconductor assembly, introduces its flagship INFINITE bonder, which achieves top performance in throughput and quality.
SAA and ASMPT Honored with Technica USA’s 2024 Supplier Alliance Awards
04/15/2025 | Technica USATechnica USA was pleased to announce the recipients of its 2024 Supplier Alliance Awards, presented at the 2025 IPC/APEX Expo in Anaheim, California. These prestigious awards recognize outstanding suppliers in the PCB fabrication and PCB assembly sectors, honoring those who go above and beyond in aligning their resources, initiatives, and expertise with Technica’s mission to achieve unparalleled success.
Dr. Thomas Marktscheffel of ASMPT Honored for his Work on Open Interfaces
03/25/2025 | ASMPTDr. Thomas Marktscheffel, Director Product Management Software Solutions at ASMPT, was honored by the IPC at this year's IPC APEX EXPO in Anaheim, California, for his many years of commitment to the organization. The non-proprietary interface standards he helped develop form the basis for ASMPT’s intelligent factory concept.
ASMPT at the Optical Fiber Communication Conference and Exposition (OFC)
03/24/2025 | ASMPTASMPT, the world’s leading provider of pioneering solutions for advanced packaging and semiconductor assembly, will present its pioneering AMICRA NANO, AMICRA NOVA PRO and MEGA bonding solutions at the ASMPT booth 5675 during the OFC 2025 trade event being held April 1-3 at the Moscone Center in San Francisco, California (USA).
ASMPT Strengthens its Global Footprint
03/21/2025 | ASMPTASMPT, the global market and technology leader for hardware and software solutions in the semiconductor and electronics industries, continues to drive the growth of its semiconductor solutions in strategically important markets.