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ASMPT Wins JSD as New Distributor

04/21/2026 | ASMPT
With this cooperation, ASMPT is increasing its presence in one of the most dynamic electronics manufacturing regions of the country while improving the support options for its local customers.

ASMPT to Show Intelligent Manufacturing Solutions at APEX EXPO 2026

01/27/2026 | ASMPT
Market and technology leader ASMPT SMT Solutions will present its innovations in the field of electronics manufacturing at the APEX EXPO 2026 to be held March 17 to 19 in Anaheim, California. At booth 1813, industry visitors can experience the company’s new SIPLACE V placement platform, the new DEK TQ XL solder paste printer, and many other hardware and software innovations.

ASMPT Secures Additional Orders for 15 Chip-to-Substrate TCB Tools Amid AI Demand

12/23/2025 | ASMPT
ASMPT, the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced it had secured additional orders for 15 Chip-to-Substrate (C2S) Thermo-Compression Bonding (TCB) tools for cutting-edge AI computing chips from a major OSAT partner of a leading foundry, following an earlier order win.

ASMPT Presents Optimized Odd Shaped Component (OSC) Package

12/10/2025 | ASMPT
With the optimized SIPLACE OSC Package, technology and market leader ASMPT SMT Solutions is strengthening the competitiveness of modern electronics manufacturing.

ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market

12/03/2025 | ASMPT
ASMPT, the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced it had won new orders for 19 Chip-to-Substrate (C2S) TCB tools from a major OSAT partner of the leading foundry serving the AI chip market.
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