Nolan’s Notes: Everyone Has Their Eye on India
Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Closing the Inspection Gap: Enhancing Electronics Manufacturing Quality With Reflow Process Inspection
October 18, 2023 | Miles Moreau, KICEstimated reading time: 1 minute
In the world of electronics manufacturing, inspection, and quality control are paramount. Manufacturing engineers, process engineers, and managers in the electronics industry are constantly seeking innovative ways to improve the reliability and performance of SMT lines, and OEM auditors want assurances of complete process control and traceability of production for their product builds. Real-time, inline inspection steps are necessary to maintain consistent quality and ensure the highest level of process control and traceability. This article sheds light on the critical role of reflow process inspection (RPI) ensuring the quality and reliability of PCBAs during reflow soldering, and briefly touches on exciting new sensing technology developed by KIC, one of the industry leaders.
The Challenge of Reflow Soldering Inspection
Reflow soldering is a unique step in PCB assembly because it involves no added material. Instead, it relies on the precise application of heat to properly solder the assembly and create reliable solder joints. Unlike other stages where technologies like solder paste inspection (SPI) and automated optical inspection (AOI) use high-resolution cameras to inspect the print of solder paste and placement of components, reflow soldering inspection presents a different technological challenge. Employing similar camera-based inspection methods during the reflow process is cost-prohibitive and technically challenging. While AOI can inspect solder joints after the reflow oven, it does not directly inspect the reflow process and confirm that the proper reflow profile was achieved.
The Role of Temperature Profiling
To ensure the integrity of the reflow soldering process, the industry relies on temperature profiling. This involves measuring and recording the temperature profile that the PCB, solder paste, and components experience as they pass through the reflow oven. This temperature profile directly impacts the quality of solder joints and the overall reliability of the PCBA.
To read this entire conversation, which appeared in the October 2023 issue of SMT007 Magazine, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Pick and Place Machine Innovator - NECTEC Launches Next-Gen SMT Line Solution With LED and X-ray Technology
08/26/2025 | Globe NewswireNECTEC PTE. LTD., a leading provider of SMT electronics manufacturing equipment, announced the official launch of its next-generation SMT solutions, featuring newly upgraded pick and place machine, specialized LED pick and place machines, enhanced Reflow Oven technology, advanced X-ray Inspection, high-speed X-ray Counter, and premium Solder Paste
BTU International to Feature Aurora Reflow Technology at SMTA Michigan and Ohio Expos
08/15/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the upcoming SMTA Michigan Expo & Tech Forum on Tuesday, August 19 in Livonia, MI, and the SMTA Ohio Expo & Tech Forum on Thursday, August 21 in Independence, OH.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Indium to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025
05/19/2025 | Indium CorporationAs a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.