The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Closing the Inspection Gap: Enhancing Electronics Manufacturing Quality With Reflow Process Inspection
October 18, 2023 | Miles Moreau, KICEstimated reading time: 1 minute
In the world of electronics manufacturing, inspection, and quality control are paramount. Manufacturing engineers, process engineers, and managers in the electronics industry are constantly seeking innovative ways to improve the reliability and performance of SMT lines, and OEM auditors want assurances of complete process control and traceability of production for their product builds. Real-time, inline inspection steps are necessary to maintain consistent quality and ensure the highest level of process control and traceability. This article sheds light on the critical role of reflow process inspection (RPI) ensuring the quality and reliability of PCBAs during reflow soldering, and briefly touches on exciting new sensing technology developed by KIC, one of the industry leaders.
The Challenge of Reflow Soldering Inspection
Reflow soldering is a unique step in PCB assembly because it involves no added material. Instead, it relies on the precise application of heat to properly solder the assembly and create reliable solder joints. Unlike other stages where technologies like solder paste inspection (SPI) and automated optical inspection (AOI) use high-resolution cameras to inspect the print of solder paste and placement of components, reflow soldering inspection presents a different technological challenge. Employing similar camera-based inspection methods during the reflow process is cost-prohibitive and technically challenging. While AOI can inspect solder joints after the reflow oven, it does not directly inspect the reflow process and confirm that the proper reflow profile was achieved.
The Role of Temperature Profiling
To ensure the integrity of the reflow soldering process, the industry relies on temperature profiling. This involves measuring and recording the temperature profile that the PCB, solder paste, and components experience as they pass through the reflow oven. This temperature profile directly impacts the quality of solder joints and the overall reliability of the PCBA.
To read this entire conversation, which appeared in the October 2023 issue of SMT007 Magazine, click here.
Share on:
Suggested Items
SMT007 Magazine Explores Soldering Technologies—December 2024
12/02/2024 | I-Connect007 Editorial TeamSoldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens
10/14/2024 | BransysBransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 3
08/14/2024 | I-Connect007 Editorial TeamChapter 3 of this book delves into the critical aspects of the SMT process, focusing on the reflow oven and automated optical inspection (AOI) machine. Highlighted are the key roles of the line operator, manufacturing engineer, and quality manager in maintaining efficient operations and high-quality PCBAs.