-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
AGC Multi Material America is Participating in the PCB Carolina Trade Show
October 18, 2023 | AGC Multi Material AmericaEstimated reading time: Less than a minute
AGC Multi Material America is participating in the PCB Carolina electronics design trade show in Raleigh, NC on November 8, 2023.
Visit us at Booth 76 to learn more about AGC Multi Material’s comprehensive material offering. We offer an entire range of substrate materials for the electronics industry including digital, RF and hybrid solutions. Ask about fastRise bondply materials, Meteorwave low loss substrates and ELL, our newest, extremely low loss laminate and prepreg series.
Stop by AGC Chemicals Americas, Inc at booth 77. Our sister company is a leading producer of fluorochemical technologies, compounds, and specialty materials.
PCB Carolina is the east coast's premiere electronics design trade show.
Suggested Items
AGC Multi Material is Highlighting their Range of Substrate Materials at IPC APEX EXPO 2025
03/04/2025 | AGC Multi Material AmericaAGC Multi Material America (AMMA) is exhibiting in the IPC Apex exhibition in Anaheim, CA on March 18 - 20, 2025.
Happy’s Tech Talk #37: New Ultra HDI Materials
02/03/2025 | Happy Holden -- Column: Happy’s Tech TalkSome new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)
AGC Multi Material to Showcase Substrate Materials at DesignCon 2025
12/31/2024 | AGC Multi Material AmericaAGC Multi Material America (AMMA) is participating in the DesignCon exhibition in Santa Clara, California, Jan. 28-30, 2025.
AGC Multi Material General Division is Launching its New Website
06/03/2022 | AGC Multi Material General DivisionAGC Multi Material General Division is launching its new website www.agc-multimaterial.com.