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AGC Multi Material America is Participating in the PCB Carolina Trade Show
October 18, 2023 | AGC Multi Material AmericaEstimated reading time: Less than a minute
AGC Multi Material America is participating in the PCB Carolina electronics design trade show in Raleigh, NC on November 8, 2023.
Visit us at Booth 76 to learn more about AGC Multi Material’s comprehensive material offering. We offer an entire range of substrate materials for the electronics industry including digital, RF and hybrid solutions. Ask about fastRise bondply materials, Meteorwave low loss substrates and ELL, our newest, extremely low loss laminate and prepreg series.
Stop by AGC Chemicals Americas, Inc at booth 77. Our sister company is a leading producer of fluorochemical technologies, compounds, and specialty materials.
PCB Carolina is the east coast's premiere electronics design trade show.
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New RF Materials Offer Options for RF Designers
04/29/2025 | Andy Shaughnessy, Design007 MagazineThe RF materials arena has changed quite a bit in the past decade. The newest thermoset laminates boast performance numbers that are almost competitive with PTFE, but without the manufacturability challenges. At IPC APEX EXPO this year, I spoke with Brent Mayfield, business development manager at AGC Multi Material America. Brent walked through some recent innovations in RF materials, advances in resin systems, and the many design trade-offs for RF engineers to consider for each material set.
AGC Multi Material is Highlighting their Range of Substrate Materials at IPC APEX EXPO 2025
03/04/2025 | AGC Multi Material AmericaAGC Multi Material America (AMMA) is exhibiting in the IPC Apex exhibition in Anaheim, CA on March 18 - 20, 2025.
Happy’s Tech Talk #37: New Ultra HDI Materials
02/03/2025 | Happy Holden -- Column: Happy’s Tech TalkSome new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)
AGC Multi Material to Showcase Substrate Materials at DesignCon 2025
12/31/2024 | AGC Multi Material AmericaAGC Multi Material America (AMMA) is participating in the DesignCon exhibition in Santa Clara, California, Jan. 28-30, 2025.
AGC Multi Material General Division is Launching its New Website
06/03/2022 | AGC Multi Material General DivisionAGC Multi Material General Division is launching its new website www.agc-multimaterial.com.