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AGC Multi Material is Highlighting their Range of Substrate Materials at IPC APEX EXPO 2025

03/04/2025 | AGC Multi Material America
AGC Multi Material America (AMMA) is exhibiting in the IPC Apex exhibition in Anaheim, CA on March 18 - 20, 2025.

Happy’s Tech Talk #37: New Ultra HDI Materials

02/03/2025 | Happy Holden -- Column: Happy’s Tech Talk
Some new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)

AGC Multi Material to Showcase Substrate Materials at DesignCon 2025

12/31/2024 | AGC Multi Material America
AGC Multi Material America (AMMA) is participating in the DesignCon exhibition in Santa Clara, California, Jan. 28-30, 2025.

AGC Multi Material General Division is Launching its New Website

06/03/2022 | AGC Multi Material General Division
AGC Multi Material General Division is launching its new website www.agc-multimaterial.com.
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