Global Citizenship: Understanding Global Citizenship as a Competitive Advantage
Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
USPAE Announces Significant Response to DBX Microelectronics Challenge
October 18, 2023 | USPAEEstimated reading time: 1 minute
The U.S. Partnership for Assured Electronics (USPAE) announced that the Defense Business Accelerator (DBX) Microelectronics Challenge received twice the number of entries expected. Nearly two-thirds of the entrants are startups, and one-third are small- to medium-sized businesses. All are vying for a chance at awards between $500,000 and $2 million to advance commercially viable microelectronics solutions.
“We are very excited by the quantity and quality of the DBX entries for innovative electronic technologies and materials,” said Nathan Edwards, USPAE executive director. “This program helps advance solutions that will have commercial and defense applications while further strengthening the U.S. electronics industry.”
In a few weeks, finalists will be notified and invited to pitch their solutions at the Defense TechConnect Innovation Summit & Expo in late November.
“Defense TechConnect draws leaders from private industry, investment and government to accelerate state-of-the-art technology solutions,” said Matt Laudon, vice president of the TechConnect Division at ATI. “The DBX project is a great example of how new approaches can leverage innovation hubs to achieve great success.”
The innovative DBX program brings together the electronics industry expertise of USPAE with the U.S. Department of Defense’s (DoD’s) Manufacturing, Capability Expansion, and Investment Prioritization Directorate (MCEIP) to award funding through a process meant to accelerate the development of commercial solutions that the DoD can then leverage.
Share on:
Suggested Items
Infineon to Revolutionize Power Delivery Architecture for Future AI Server Racks with NVIDIA
05/21/2025 | InfineonInfineon Technologies AG is revolutionizing the power delivery architecture required for future AI data centers. In collaboration with NVIDIA, Infineon is developing the next generation of power systems based on a new architecture with central power generation of 800 V high-voltage direct current (HVDC).
Jabil, AVL Collaborate on Design and Manufacturing Solutions for Automotive and Transportation Customers
05/21/2025 | BUSINESS WIREJabil Inc., a global manufacturing solutions provider to market-leading automakers, announced it has signed a memorandum of understanding (MOU) with AVL Software and Functions GmbH, the e-drive and software center of AVL List GmbH.
DuPont, Epicore Biosystems Collaborate to Advance Worker Safety Through Smart Wearable Technology
05/21/2025 | DuPontEpicore Biosystems, a digital health solutions leader developing advanced sweat-sensing wearables, and DuPont Personal Protection (DuPont), a global leader in personal protection solutions, have agreed to work together to explore opportunities to potentially enhance worker safety and well-being.
Geospace Unveils New Brand Identity Reflecting the Company’s Move into Diverse Markets
05/20/2025 | BUSINESS WIREGeospace Technologies Corporation announces a new brand identity, reflecting the company's transformation of its leadership and culture along with a redefined strategy focused on applied intelligent technology.
Yank Technologies Selected for Prestigious NASA Phase II Contract for Dust-Tolerant Resonant Connectors
05/20/2025 | PRNewswireYank Technologies, the developer of disruptive long range, high power wireless charging solutions, has been selected for a two-year follow-on Small Business Innovation Research (SBIR) Phase II contract from the National Aeronautics and Space Administration (NASA) to advance Dust-Tolerant Resonant Connectors for lunar and planetary surfaces.