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Powering the Future: Why Thermal Management Defines the Future of Electronics

04/15/2026 | Brian Buyea -- Column: Powering the Future
Every leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.

Kurtz Ersa Brings Selective Soldering and Large-Board Rework Power to EPTECH Toronto and Montreal

04/02/2026 | Kurtz Ersa Inc.
Kurtz Ersa Inc., a leading supplier of electronics production equipment, in collaboration with its long-time Canadian representative Comtree Inc., is headed to EPTECH Toronto 2026 on April 21 and EPTECH Montreal 2026 on April 23.

OKI Launches EMS for AI Server Equipment Featuring Proprietary High Heat Dissipation Technology

03/25/2026 | BUSINESS WIRE
OKI will launch Comprehensive Electronics Manufacturing Services (EMS) for AI server equipment on March 25, 2026.

Indium to Spotlight Thermal Innovations Enabling Next-Generation AI Systems at Productronica China 2026

03/20/2026 | Indium Corporation
As a proven leader in soldering materials and metal thermal interface materials (TIMs) solutions for future-forward technologies, Indium Corporation® will showcase its AI-enabling product portfolio at Productronica China, March 25-27, in Shanghai, China.

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

03/17/2026 | Chandra Gupta -- Column: Below the Surface
In my last column, I described the ceramic substrate itself, and why material choice matters so deeply in RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, stability across temperature, and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise.
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