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Discover the New Podcast Series on Thermal Management—Now Available

03/05/2025 | I-Connect007
In this premiere podcast episode, Ryan Miller of NCAB breaks down why thermal management is a must for PCB designers. What are the main causes of excess heat in our designs today? Why does it matter? And how can designers keep their boards cool under pressure?

Advancements in Thermal Management: Material Talk With DuPont

02/06/2025 | Marcy LaRont, I-Connect007
As our DesignCon coverage continues, this insightful discussion featuring Mike Kwasny, business development manager at DuPont, delves into technologies and innovations in electronics manufacturing featuring their unique material solutions, including their Kapton film and Pyralux laminate lines. 

NovoLINC Secures Investments to Assist AI Computing with Groundbreaking Thermal Interface Technology

01/21/2025 | PRNewswire
NovoLINC, a thermal technology startup spun out of Carnegie Mellon University, announced seed funding led by M Ventures, with participation from Foothill Ventures and TDK Ventures. NovoLINC's breakthrough nanocomposite thermal solutions reduce thermal resistance to an industry-record low (< 1mm²-K/W), according to company co-founders, CSO Prof. Sheng Shen and CTO Dr. Rui Cheng.

Compal Adopts Intel Tech for Innovative Liquid Cooling Solutions

12/26/2024 | Compal Electronics Inc.
Compal Electronics, a leading server solution provider, announced today its collaboration with Intel, BP Castrol (Castrol), JWS, and Priver to launch a groundbreaking liquid cooling solution based on Intel’s Targeted Flow technology. Designed specifically for high-density servers and AI data centers, this innovative solution aims to drive the industry toward a more efficient and sustainable future.

OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space

12/12/2024 | BUSINESS WIRE
The OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
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