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Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available
April 30, 2025 | I-Connect007Estimated reading time: 1 minute
I-Connect007 is excited to share the latest episode in our new podcast series, delivering expert technical insights for the printed circuit board and electronics manufacturing industry.
In On the Line with... NCAB: PCB Thermal Management, host Nolan Johnson turns up the heat with NCAB field application engineer Ryan Miller.
In this episode, Ryan returns to discuss practical strategies for managing heat, starting early in the design planning and specification phases. After all, prevention means there’s less to mitigate later.
As the industry’s longest-running digital media company, I-Connect007 brings you the content you need—magazines, books, in-depth features, newsletters, podcasts, webinars, and event coverage—to keep you informed and ahead of the curve.
Don’t miss episode two of this insightful series—and be sure to download the free companion guide!
Learn about this and other topics at On the Line with... I-Connect007, Apple, or Spotify today.
Visit our educational resource center to access more free content.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
05/06/2026 | I-Connect007I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.
What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience
04/16/2026 | I-Connect007 Editorial TeamI-Connect007 continues its six-part podcast series with Isola experts titled, PCB Materials: The Backbone and Future of Electronics, with the release of Episode 5, which shifts focus to one of the industry’s most urgent challenges: supply chain resilience.
Podcast Hits the Mark in a Materials Market
04/15/2026 | Marcy LaRont, I-Connect007The base material of a printed circuit board is its literal and functional foundation. Isola, founded in 1912 in Düren, Germany, is one of the longest-standing manufacturers of glass-reinforced laminates in the electronics industry. Originally focused on insulation and fiberglass materials, the company played an early role in supplying the foundational substrates that enabled the growth of PCB technology. As electronics advanced, Isola evolved alongside the industry, expanding from basic glass-epoxy laminates into high-performance copper-clad materials and engineered prepregs.
I-Connect007 Releases Episode 4 of ‘PCB Materials: The Backbone and Future of Electronics’ Podcast Series
04/09/2026 | I-Connect007I-Connect007 is excited to announce the release of Episode 4 in its six-part podcast series with Isola experts, PCB Materials: The Backbone and Future of Electronics. Titled “Reliability Under Pressure—PCBs in Harsh Environments,” this episode explores the challenges of maintaining long-term performance in demanding applications like aerospace, automotive, and defense. Host Marcy LaRont speaks with Laura Martin, director of strategic markets at Isola, about what reliability truly means when printed circuit boards are pushed to their limits.
Companion Guide to Popular UHDI Podcast Series Now Available for Download
03/23/2026 | I-Connect007The companion guide to On the Line With…American Standard Circuits: Ultra High Density Interconnect (UHDI) explores how UHDI is reshaping PCB design and manufacturing. As trace widths shrink from 25 microns toward 5 microns, UHDI enables finer geometries, tighter impedance control, improved RF performance, and reduced layer counts.