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LITEON Power Innovations Showcases Installation of Level 3 DC Fast Charger with Partner
October 23, 2023 | LITEON TechnologyEstimated reading time: 1 minute
LITEON Technology continues to set industry milestones with its latest portfolio addition: a Level 3 Electric Vehicle (EV) DC fast charger. Launched by Power Innovations International (Pii) - a subsidiary of LITEON - these EV chargers easily integrate with existing electrical infrastructure due to their multi-voltage input, which enables users to quickly install the product while avoiding additional infrastructure and installation costs. These can be integrated in any input voltage configuration found in US power distribution infrastructure with no derating to the base power purchased.
The EV charger portfolio comes with modular and stackable power capabilities – and no derating feature among any of the different input configurations. Pii recently installed 30 and 60 kilowatt versions onsite with a US partner, showcasing its adaptability to use available existing infrastructure from 240 Vac up to 480 Vac in the same product with no derating. With LITEON's power electronic expertise and industry-leading technology, users can expect a rapid and seamless charging experience.
Pii Provides Cutting-edge DC EV Charging Solutions from 30kW to 180kW
Pii is a US-based company that specializes in providing clean, efficient power solutions. It has long been an industry leader in power management solutions – in particular, uninterruptible power supplies and power distribution equipment since its founding in 1997 – and now includes EV charging solutions. LITEON acquired Pii in 2013, combining LITEON's global reach and manufacturing capabilities with Pii's expertise in critical power applications. This charger represents the first time that a Pii product has incorporated LITEON's power conversion technology in a design.
Pii's EV DC fast charging systems, ranging from 30kW up to 180kW, offer high-speed charging solutions that are suitable for private or public use, including public EV infrastructure, EV fleets, dealerships, C-Store, and similar commercial applications, as well as mobile fast charging.
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SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Flex Announces New AI Infrastructure Platform to Speed Deployment by Up to 30%
10/13/2025 | FlexFlex announced the industry's first globally manufactured, fully integrated platform designed for gigawatt data centers supporting AI and HPC.
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
10/13/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).