-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Ventec Giga Solutions to Distribute Hi-Print Inkjet Portfolio for Precision PCB Printing
November 7, 2023 | Ventec International GroupEstimated reading time: 2 minutes

Ventec Giga Solutions, the equipment division of Ventec International Group that delivers turnkey workflow solutions, including equipment selection, installation, and commissioning, has reached an agreement to distribute high-performance inkjet-printers from Hi-Print in Europe and North America.
Hi-Print creates advanced, high-accuracy inkjet printers for precision printing of solder masks and PCB identification including legends and QR codes. As a high-speed, digital alternative to silk-screen printing, Hi-Print’s inkjet solutions are configurable, programmable, efficient, clean, and ready to start printing instantly after the design is loaded.
“Since we first met Hi-Print, we have been excited about the innovation and quality evident in the products and the opportunities to grow sales in our marketplace,” said Ramesh Dhokia, Business Unit Director, Ventec Giga Solutions. “With Ventec’s extensive distribution network, market knowledge, supply-chain management capabilities, and customer support services, we expect to build a strong and close partnership that will deliver enduring success.”
“Our printers bring game-changing speed and flexibility to electronic manufacturing, and we are confident that Ventec Giga Solutions can grow sales in high-value territories throughout Europe and North America,” said Hi-Print CEO Mr Cheng Wen. “We are looking forward to working with Ramesh and his team and to jointly focusing our energies on ensuring the success of this relationship.”
The Hi-Print portfolio includes single- and dual-workbench inkjet printers, highly automated printers including inline models, the AR20LK roll-to-roll printer for flexible printed circuit, and the SD200 dedicated double-workbench solder-mask printer. Capable of producing several thousand units per day, the printers offer outstanding features that enhance flexibility and productivity, including multiple configurable print heads, automated clamping, and one-touch operation.
Ventec Giga Solutions handles factory design, equipment selection, sales, installation, commissioning and training on behalf of customers. The division’s competencies and connections with numerous leading equipment suppliers, combined with the Ventec portfolio of high-performance substrate laminates and prepregs, presents a one-stop-shop for PCB manufacturers, OEMs, and manufacturing services companies to quickly establish and rapidly expand their facilities.
Additional content from Ventec International Group:
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh
- The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art
- The Solutions Guide to... Thermal Management
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007eBooks library.
Suggested Items
Real Time with... IPC APEX EXPO 2025: Exploring Ventec's Innovations
04/09/2025 | Real Time with...IPC APEX EXPOMark Goodwin highlights Ventec's global distribution network and recent expansions in service and equipment offerings. He emphasizes the company's expertise in coating technology for thermal management, specialized materials, and its agility in creating customized solutions for customers.
Ventec Presents Cutting Edge Innovations and High-performance Formulas at IPC APEX EXPO 2025
03/14/2025 | Ventec International GroupVentec International Group is presenting new substrate materials and proven formulas for high-performance PCBs at IPC APEX Expo 2025, alongside the latest advances in manufacturing equipment from Ventec Giga Solutions.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
Chris Mundy Joins Ventec as Commercial Director for EMEA & Americas
03/07/2025 | VentecVentec International Group is delighted to announce the appointment of Chris Mundy as Commercial Director for EMEA & Americas.
Sunny Kwok Joins Ventec as Technical Sales Representative for UK and EMEA
02/14/2025 | VentecVentec is pleased to announce the appointment of Sunny Kwok as Technical Sales Representative for UK and EMEA regions. Sunny will further enhance service support levels for Ventec full range of materials including non-reinforced resin coated copper and film products (thermal/Pro-bond), high speed/low loss (tec-speed) and Ventec’s full range of halogen free materials for high reliability applications.