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Advanced Electronics Packaging Digest

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Amkor Technology Expands Arizona Investment to $12 Billion

09/10/2026 | Amkor Technology
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus.

Foxconn Expands U.S. AI Footprint With California Property Acquisition

08/28/2026 | I-Connect007 Editorial Team
Foxconn is expanding its U.S. presence with the acquisition of land and a manufacturing facility in Santa Clara, California, as the electronics manufacturing giant continues to invest in AI-related business.

KLA Invests in Operations in Wales with the Opening of a $138 Million R&D and Manufacturing Facility

05/23/2025 | PRNewswire
KLA Corporation, a global leader in semiconductor process control and process-enabling technology, announced the opening of its new $138 million research and development (R&D) and manufacturing center in Newport, Wales, U.K., continuing the company's history of regional investment. SPTS, KLA's Wales-based product division, has been leading semiconductor equipment innovation in Wales since 1984, winning multiple Queen's Awards for excellence in R&D and export, and attracting strong technical talent to the region.

IPC APEX EXPO Named One of Trade Show Executive’s Top 100, Class of 2024

02/24/2025 | IPC
Trade Show Executive, the foremost magazine for the trade show industry, recognized IPC APEX EXPO 2024 as one of the top 100 fastest-growing trade shows in the United States for the number of exhibiting companies and net square footage.

Benchmark Breaks Ground on its 5th Facility in Penang

02/24/2025 | Benchmark
Benchmark Penang, a global leader in engineering, design, and manufacturing services, today held a groundbreaking ceremony for PT4 facility which is also their 5th facility here in Penang.
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