-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Nihon Superior’s Keith Sweatman Wins a Coveted SMTA International Best Paper Award
November 13, 2023 | Nihon Superior Co. LtdEstimated reading time: 1 minute
Nihon Superior Co. Ltd., a supplier of advanced joining materials, proudly announces that their Senior Technical Advisor, Keith Sweatman, has been honored with a coveted SMTA International Best Paper Award. This prestigious award was presented during the SMTA International 2023 Recognition Dinner, where Keith Sweatman was acknowledged as one of the four speakers who presented papers at the 2022 conference that were judged by their peers as the best in their respective categories.
Keith Sweatman's award-winning paper, titled "The Effect of Strain Rate on the Ductility of Bismuth-Containing Solders," may seem to be remote from the day-to-day realities of electronics manufacturing. However, it has been acknowledged as making a significant contribution to an issue that is presenting a challenge comparable with that which the industry had to face two decades ago when, driven by the EU RoHS Directive, it had to move to lead-free solders.
Sweatman's paper provides an insight into one of the challenge the electronics manufacturing industry faces as it struggles to respond to the need to reduce the temperature required for soldering processes; the tendency of low temperature solder alloys containing bismuth to brittle failure. He reported the results of a study in which it was found that in tensile testing at a low strain rate even alloys with a high bismuth content could exhibit considerable ductility because of a change in the way the bismuth phase responds to stress. These findings provide a basis for the development solder alloys that will make it possible for the electronics manufacturing industry to move to low temperature soldering without compromising reliability.
The work reported was conducted by a team of researchers working under the guidance of Professor Kazuhiro Nogita at the Nihon Superior Centre for the Manufacture of Electronic Materials, located on the University of Queensland campus in Australia.
Suggested Items
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
It’s Only Common Sense: You’ve Got to Hustle
12/16/2024 | Dan Beaulieu -- Column: It's Only Common SenseWe can’t control many things: the economy, what our competitors are doing, and even sometimes what our customers think. But one thing that’s fully within our control is how hard we work. As a professional salesperson, if you’re not willing to put in the hustle and outwork everyone else in the room, you’ll be left behind. Let’s get something straight immediately: There are no shortcuts in sales. There’s no magic formula that will allow you to succeed without putting in the effort. The idea that working smarter can replace hard work is a myth. It’s not one or the other. It’s both. Working harder and smarter is the only way to win.
EIPC Technical Snapshot: Factors Driving the Fluctuating Demand for PCBs
12/11/2024 | Pete Starkey, I-Connect007EIPC continued its series of online Technical Snapshots with a webinar on Nov. 21 presented by Dr. Hayao Nakahara of N.T. Information Ltd, who summarised world PCB production and shared his vision of the market over the next five years. With information gathered from many sources, Nakahara examined factors driving the increasing demand for printed circuit boards.
Working on a Personal Level at Stellar Technical Products
12/11/2024 | Nolan Johnson, SMT007 MagazineMaking the world a better place isn’t just a snappy slogan to put on their marketing collateral for Southern California-based distributor Stellar Technical Products. CEO Mike Min is looking for partners that want to optimize their bottom line, increase their resilience, and create a more sustainable planet. It’s the mission statement for the company, and Mike is working diligently to take that message forward. In this interview he shares the qualities that make Stellar Technical unique.
SolderKing Celebrates a Year of Expansion, Innovation, and Sustainability Achievements
12/09/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has wrapped up 2024 with a series of milestones that reflect its ongoing growth and commitment to innovation.