OSI Systems Receives $5 Million in Orders for Electronic AssembliesNovember 20, 2023 | BUSINESS WIRE
Estimated reading time: Less than a minute
OSI Systems, Inc. announced that its Optoelectronics and Manufacturing division has received orders totaling approximately $5 million to provide electronic assemblies to a leading motion control and fluid technology OEM.
OSI Systems’ Chairman and Chief Executive Officer, Deepak Chopra, commented, “We are delighted to continue supporting this customer that serves a variety of end-markets worldwide.”
Airbus has signed a contract with the Spanish Ministry of Defence for the development and acquisition of SIRTAP, a High Performance Tactical UAS that will reinforce the tactical capabilities of the Spanish Army and the Air and Space Force.
Marc Aicheler and Pete Starkey discuss TSK’s horizontal vacuum systems, including vacuum etching process equipment. Aicheler details the benefits of a vacuum etch in managing challenges such as etchant puddling, etc. Aicheler also teases at a vacuum alkaline etchant systems as well.
While previous industrial revolutions have introduced factories, mass production, and computer-controlled systems, the advent of Industry 4.0 and the concept of the Smart factory have ushered in a new era in PCB manufacturing. For the PCB industry it is a very ambitious and aspirational objective to evolve from disconnected processes to an integrated system with automated data capture, real-time data analysis, process visualization, autonomous control, and self-correcting processes.
Ansys Collaborates with TSMC and Microsoft to Accelerate Mechanical Stress Simulation for 3D-IC Reliability in the Cloud11/20/2023 | ANSYS
Ansys has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems manufactured with TSMC’s 3DFabric™ advanced packaging technologies.
Intelsat, operator of one of the world’s largest integrated satellite and terrestrial networks and leading provider of connectivity to the U.S. Government, has tapped David J. Broadbent as its new President, Government Solutions. Effective today, Broadbent is responsible for Intelsat’s government business globally and joins the company’s seven-member Management Committee. He reports to Intelsat Chief Executive Officer David C. Wajsgras.