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Cadence Digital, Custom/Analog Flows Certified for Latest Intel 18A Process Technology

02/22/2024 | Cadence Design Systems
Cadence’s digital and custom/analog flows are certified on the Intel 18A process technology. Cadence® design IP supports this node from Intel Foundry, and the corresponding process design kits (PDKs) are delivered to accelerate the development of a wide variety of low-power consumer, high-performance computing (HPC), AI and mobile computing designs.

Cadence Unveils Millennium Platform—Delivering Unprecedented Performance and Energy Efficiency

02/02/2024 | Cadence Design Systems
Cadence Design Systems, Inc. announced the Cadence® Millennium™ Enterprise Multiphysics Platform, the industry’s first hardware/software (HW/SW) accelerated digital twin solution for multiphysics system design and analysis.

Cadence Advances ECAD/MCAD Convergence with Celsius Studio AI Thermal Platform

02/01/2024 | Cadence Design Systems
Cadence Design Systems, Inc. announced Cadence® Celsius™ Studio, the industry’s first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies.

Phison Deploys Cadence Cerebrus AI-Driven Chip Optimization to Accelerate Product Development

01/23/2024 | Cadence Design Systems
Phison Electronics Corporation is a market leader in NAND Flash controllers and applications, including USB, SD, eMMC, PATA, SATA, PCIe, and UFS.

GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform

01/10/2024 | Cadence Design Systems
Global Unichip Corporation (GUC), a leading global ASIC provider, has successfully taped out a complex 3D stacked die design on an advanced FinFET node process.
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