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IPC Applauds New U.S. Government Strategy for Advanced PackagingNovember 22, 2023 | IPC
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The U.S. Government’s announcement of a national strategy for “advanced packaging” under the CHIPS for America Program is a big step toward ensuring the resiliency and security of the U.S. supply chain for advanced electronics.
The “Vision for the National Advanced Packaging Manufacturing Program” (NAPMP), released today by the U.S. Commerce Department, says approximately $3 billion will be used to drive U.S. leadership in advanced packaging, with an initial funding opportunity to be announced in early 2024.
IPC has been the leading advocate for a “silicon-to-systems” approach to implementation of the CHIPS Act. A silicon-to-systems approach recognizes the importance of silicon fabrication, while underscoring the need for broader electronics manufacturing capabilities—including PCB fabrication and electronics assembly—to ensure that the U.S. can manufacture cutting edge technologies.
“Advanced packaging” today is driving semiconductor innovation by introducing greater electronic interconnection within semiconductor packages. Electronic interconnection is a capability that has been marginalized in the U.S. but is now key to U.S. semiconductor leadership.
“Indeed, advanced packaging is poised to play a major role in the development of chips for artificial intelligence, cloud computing, and medical applications, among many other next-generation technologies,” the Commerce Department stated earlier this year.
However, a 2021 IPC report found the U.S. has only just begun to invest in advanced packaging, while nations in Asia have sprinted ahead to develop the lion's share of capabilities and capacity. The U.S. only accounts for 3% of global semiconductor packaging and lacks even state-of-the-practice capabilities.
IPC has documented that an “ecosystem” approach covering several related electronics technologies is essential to achieving the goals of the CHIPS Act. For example, IPC believes the U.S. Government also must build up domestic capacity to produce advanced integrated-circuit (IC) substrates and printed circuit boards (PCBs).
“Bolstering chip production without commensurate growth in advanced packaging, PCB fabrication, and electronic assembly is likely to lengthen the supply chain and exacerbate glaring vulnerabilities in U.S. electronics manufacturing,” says Chris Mitchell, IPC VP of Global Government Relations.
Qualcomm Unveils the World’s Most Advanced 5G Modem-RF System, Harnessing Integrated AI to Enable the Next Generation of 5G03/04/2024 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc., has been a leader in 5G technologies since inception, and today is continuing to set the pace of innovation by announcing the Snapdragon® X80 5G Modem-RF System, the seventh generation of its 5G modem-to-antenna solution.
ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce its return to IPC APEX 2024, the largest electronics manufacturing event in North America. ViTrox eagerly invites visitors to explore our offerings at Booth #2642, Anaheim Convention Center, LA, from April 9th to 11th. During this time, we will unveil a series of cutting-edge inspection solutions poised to revolutionize manufacturing production lines.
Electronics Industry Praises U.S. Government Notice of Funding Opportunity for 'Advanced Packaging' Technologies02/29/2024 | IPC
IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.
Nano Dimension Ltd., a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, today announced a series of updates covering its repurchase plan, repeat customer success, and an R&D milestone.
SMTA will be hosting a new symposium on March 26th in Phoenix focused on Ultra High-Density Interconnect (HDI) technology. As the semiconductor industry charges forward, demanding ever-increasing performance and miniaturization, the SMTA Ultra HDI Symposium sets the stage for industry pioneers, researchers, engineers, designers, and academia to engage in the active sharing of information while addressing the complexities and innovations reshaping the world of Ultra HDI technology.