Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Season Group Earns EcoVadis Silver, Ranks in Top 15% Globally

08/13/2026 | PRNewswire
Season Group has been awarded the EcoVadis Silver Medal, recognizing the company among the top 15% of organizations assessed by EcoVadis for its sustainability management practices.

Trouble in Your Tank: At 40 GHz, Everything Matters, Part 2

07/27/2026 | Michael Carano -- Column: Trouble in Your Tank
In Part 1 of this article, we examined alternative solderable finishes for 5G/6G applications and reviewed literature on their performance at high frequencies. We found that certain solderable finishes are more susceptible to signal loss as frequency increases. These attenuation losses become increasingly significant at frequencies approaching and exceeding 40 GHz. Because of their high conductivity, silver and copper generally outperform finishes such as nickel and palladium. Taken together, these findings underscore the importance of finish selection in high-frequency applications.

MacDermid Alpha Launches ATROX® CD 560-1: Zero PFAS Alternate Silver Filler Die Attach Paste

06/18/2026 | MacDermid Alpha Electronics Solutions
With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX® CD 560-1, a zero per- and polyfluoroalkyl substances (PFAS) alternate silver filler die attach paste designed for metal leadframe packages and high-speed automated dispensing in modern manufacturing environments.

MacDermid Alpha to Address Silver Price Volatility Solutions at ECTC 2026

05/15/2026 | MacDermid Alpha
As volatile silver prices continue to place pressure on semiconductor packaging costs and supply chain predictability, MacDermid Alpha Electronics Solutions will highlight material strategies that help manufacturers reduce dependence on silver without sacrificing reliability, thermal performance, or manufacturing efficiency.

Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish

05/07/2026 | Matt Stevenson -- Column: Connect the Dots
When designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in