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Reassessing Surface Finish Performance for Next-gen Technology, Part 2

03/04/2024 | Frank Xu, PhD and Martin Bunce of MacDermid Alpha, and John Coonrod of Rogers Corp.
The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.

MacDermid Alpha's Sintering Technologies Take Center Stage at PCIM Asia

08/29/2023 | MacDermid Alpha
MacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Asia, held at Shanghai New International Expo Center - SNIEC, 29 - 31 August 2023.

DuPont Introduces SOLDERON BP TS 7000 Chemistry

05/31/2023 | PRNewswire
DuPont Electronics & Industrial introduced DuPont SOLDERON BP TS 7000, the latest innovation in tin-silver plating chemistry, at the IEEE Electronic Components and Technology Conference (ECTC) in Orlando, Florida.

MacDermid Alpha Electronics Solutions Expands its Argomax Sintering Technologies

04/04/2023 | MacDermid Alpha Electronics Solutions
MacDermid Alpha, one of the world’s largest providers of circuitry, assembly, and semiconductor solutions for electronics manufacturers, has expanded the Argomax® technology offering. Argomax® 2148 is a new silver sintering product, designed for electric vehicle power inverters.

Two Indium Corporation Experts to Present at APEC

03/08/2023 | Indium Corporation
Two Indium Corporation experts are set to present at APEC 2023, March 19-23, in Orlando, FL. Senior Research Chemist Dr. Sihai Chen will present a technical poster titled Highly Reliable Silver Sintering Joints for Power Module Applications, while Product Manager Joe Hertline will deliver a presentation titled A Novel Material Technology that Reduces Tooling Dependency and Process Complexity in Power Module Soldering and Sintering Applications.
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