-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCertifications
Certifications have historically been seen as a cost of doing business, but how do we turn them into a positive ROI and a value to both customer and vendor?
The Butterfly Effect
The basis of chaos theory is a key concept known as the “butterfly effect.” It’s the idea that a small event in one place creates a cascading set of events elsewhere. So, how is the EMS landscape changing? We’re tracking the concerns and dynamics of this landscape, and there’s a lot to learn.
Coming to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Texas Instruments Chairman Rich Templeton Elected Chair of Semiconductor Industry Association
November 23, 2023 | SIAEstimated reading time: 2 minutes
The Semiconductor Industry Association (SIA) today announced Texas Instruments Chairman of the Board Rich Templeton has been elected Chair of the SIA Board of Directors and Western Digital CEO David Goeckeler has been elected SIA Vice Chair. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
“It is a great pleasure to welcome our new leadership team for the year ahead, Rich Templeton of Texas Instruments and David Goeckeler of Western Digital,” said John Neuffer, SIA President and CEO. “Rich is extremely knowledgeable about the challenges we face as an industry and how we can overcome them, and David is a seasoned industry veteran and a highly effective champion for SIA’s priorities. Together, they will make an outstanding team as leaders of the SIA Board of Directors in 2024.
Templeton became Chairman of Texas Instruments in April 2008 and was President and CEO from May 2004 through March 2023. From April 2000 through April 2004, Templeton was Chief Operating Officer of TI. He was Executive Vice President of the company and President of TI’s semiconductor business from June 1996 through April 2004. As CEO, Templeton maintained the company’s strategic investments in R&D and manufacturing, while expanding the size of the sales and applications engineering team to better serve TI customers. Under his leadership, TI emerged stronger, with better technological and product positions in both its core businesses. Templeton joined the company in 1980 after earning a B.S. in electrical engineering from Union College in New York.
“Semiconductor technology is making the world smarter, greener, more efficient, and better connected, and effective government policies are needed to help the industry continue to grow and innovate,” said Templeton. “I look forward to working alongside my colleagues on the SIA Board to advocate for industry priorities in Washington and capitals around the world.”
Since joining Western Digital in March 2020, Goeckeler has focused on the company’s transformation as the leading data storage producer in the industry. Before becoming CEO, he was Executive Vice President and General Manager of Cisco’s Networking and Security Business, with responsibility for more than $34 billion of the company’s global technology franchise. He led a worldwide team of more than 25,000 engineers and oversaw Cisco’s networking and security strategy and market acceleration, including development operations for the company’s expansive technology portfolio and strategic acquisitions.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/26/2024 | Nolan Johnson, I-Connect007This week, I’ve been attending Thailand Electronic Circuits Asia 2024. This is the inaugural event, hosted by Thailand Printed Circuit Association (THPCA) in collaboration with the Hong Kong Printed Circuit Association (HKPCA). Thailand has supported a PCB industry for some time—mostly automotive applications—but the China Plus One dynamic has definitely taken root here.
iNEMI Packaging Tech Topic Webinar: Equipment Capabilities and Challenges to Support Advanced Packaging Trends
07/26/2024 | iNEMIModern day computing needs, notably AI/machine learning and high-performance computing, along with their subsequent memory and I/O requirements, are fueling an increased demand for semiconductor devices with higher performance, lower power consumption and latency as well as reduced footprint.
Looking For That Perfect Job? Check Out jobCONNECT007
07/25/2024 | I-Connect007 Editorial TeamThere are a lot of open positions in this industry today. But where do you begin to look? We have the answer: jobCONNECT007, your guide to career opportunities in the electronic industry. In jobCONNECT007, you’ll find job openings that span the entire circuit board supply chain. Whether you’re involved in design, fabrication, assembly, test, or material development or distribution, this handy resource can help you get on your way to a new gig.
Lockheed Martin Awards Critical SPY-7 Radar Manufacturing to Spanish Companies
07/25/2024 | Lockheed MartinLockheed Martin, the global aerospace and deterrence company, awarded Indra, Escribano Mechanical and Engineering, and ICM (Integral de Conexión y Montajes, S.L.) purchase orders for AN/SPY-7(V)2 components on the F-110 frigate.
Thailand Electronics Circuit Asia 2024 Kicks Off
07/24/2024 | Nolan Johnson, I-Connect007After a long and grueling experience through last week’s airline IT meltdowns, I finally touched down in Bangkok, where I’m here for the inaugural Thailand Electronics Circuit Asia (THECA) show. The expo and technical conference kicked off Wednesday at the Bangkok International Trade and Exhibition Center, featuring an expo and a technical conference.