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Precision Technology Joins Forces with Epec Engineered Technologies
December 1, 2023 | Epec Engineering TechnologiesEstimated reading time: 1 minute
Precision Technology, Inc. (PTI) and Epec Engineered Technologies shared that they have joined together to give customers a greater range of high-quality printed circuit boards and other electronic products.
Bob Jones, President of PTI, stated: “Due to the globalization and economics of this industry, PTI has extensively searched for a partner to consolidate with seamlessly without disruption and who will continue to give our customers good quality, prices, and deliveries.”
Epec has been in business since 1952, with numerous manufacturing plants throughout the United States and Asia producing time-sensitive printed circuit boards, quick-turn prototypes, and large production orders, along with flex and rigid-flex printed circuit boards.
After 55+ years in the printed circuit industry, the legacy of PTI has been passed to Richy Reynolds, who has serviced customers for many years and will continue to be your point of contact, carrying forward customer relationships as a member of the Epec team.
Ed McMahon, CEO of Epec, LLC, stated: “We are very excited and welcome PTI and their customers into the growing Epec family. Bob and Richy have built a business with a tremendous reputation for putting the customer first, which seamlessly fits into Epec’s core values.
“As Epec has successfully executed over 13 transactions exactly like this one with PTI, we are confident of a smooth and seamless transition of all the long-term PTI customers. We are very excited to springboard our focus in the Western U.S. with the addition of Richy and his years of technical experience. With 4 PCB shops closing over the past few months, we are uniquely positioned to grow our business through acquisitions given our significant financial and operational resources.”
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08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/01/2025 | Nolan Johnson, I-Connect007We start with the latest report from the Global Electronics Association: North American PCB sales are down 8.6% in June. That might sound grim, but keep reading—there’s more to the story. Bookings are holding steady, and Dr. Shawn DuBravac offers context that paints a more balanced picture. Next, we turn our gaze to India, where mobile phone exports have surged 127-fold over the past decade. That stat alone says volumes about India’s emergence as a force in electronics manufacturing, something we’ll be digging into more deeply in an upcoming SMT007 feature.
Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity
07/31/2025 | PRNewswireTeramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.
New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
07/28/2025 | I-Connect007The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry.