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HPC Customer Engages Sondrel for High End Chip Design

11/25/2024 | Sondrel
Sondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.

Altus Partners with G&B Electronic Designs to Enhance Inspection Capabilities

10/23/2024 | Altus Group
Altus Group, a leading distributor of electronics assembly equipment in the UK and Ireland, has supported G&B Electronic Designs Ltd., a prominent EMS in the UK, in enhancing its inspection processes through the installation of the Koh Young Zenith Alpha HS+.

Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar

09/16/2024 | BUSINESS WIRE
Omni Design Technologies, a leading provider of high-performance, low-power data acquisition and signal-processing solutions, and Aura Intelligent Systems, a developer of high-resolution imaging radar for ADAS and autonomous vehicles, announced a partnership on Aura’s next generation digital radar development.

Zuken Introduces Harness Builder 2025 for E3.series with Enhanced Integration and Documentation Capabilities

09/11/2024 | Zuken
Zuken, a global leader in electrical and electronic digital engineering solutions, is proud to unveil the 2025 version of its industry-leading Harness Builder for E3.series software. 

StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium

09/11/2024 | StratEdge
StratEdge Corporation announces that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France from September 24-27, and booth 313 at IMAPS International Symposium for Microelectronics being held at the Encore Boston Harbor in Everett, Massachusetts, on October 1-2.
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