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Real Time with... productronica 2023: Alltemated's Patented Adhesive Improves Solder Joint Reliability
December 6, 2023 | Real Time with...productronicaEstimated reading time: Less than a minute
Randy Temple of Alltemated explains how his company’s Place-n-bond™ underfilm is applied at pick and place. The product is made of thermoplastic which means it is 100% reworkable.
If you were unable to attend productronica 2023, don't worry. We're bringing you coverage of many of the week's events in Munich.
Watch this interview below or click here to view on our Real Time with... productronica 2023 show page.
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Sweeney Ng - CEE PCBSuggested Items
SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
10/09/2025 | SEMIGlobal 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/08/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
Datest Marches Into SMTA International with Backup Plans, Big Partnerships, and Bigger X-rays
10/06/2025 | DatestDatest, the industry’s favorite second set of eyes (and hands, and solder joints), is heading to SMTA International 2025 at the Donald E. Stephens Convention Center in Rosemont, IL. Find us at Booth #2627, where high-reliability, high-complexity builds meet their match.
Imec’s New GeSi Modulator Hits 400Gb/s, Paving the Way for Next-Gen Optical Interconnects
10/02/2025 | ImecImec – a world-leading research and innovation hub in nanoelectronics and digital technologies – today announced the successful demonstration of a beyond-110GHz C-band GeSi electro-absorption modulator, fabricated on its 300mm silicon photonics platform.