Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Real Time with... productronica 2023: Alltemated's Patented Adhesive Improves Solder Joint Reliability
December 6, 2023 | Real Time with...productronicaEstimated reading time: Less than a minute
Randy Temple of Alltemated explains how his company’s Place-n-bond™ underfilm is applied at pick and place. The product is made of thermoplastic which means it is 100% reworkable.
If you were unable to attend productronica 2023, don't worry. We're bringing you coverage of many of the week's events in Munich.
Watch this interview below or click here to view on our Real Time with... productronica 2023 show page.
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