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Infineon CEO Jochen Hanebeck Becomes New ESIA President
December 7, 2023 | ESIAEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/6717/0195/5584/Infineon_Jochen_Hanebeck.jpg)
The General Assembly of the European Semiconductor Industry Association (ESIA), representing the European semiconductor industry and broader ecosystem, unanimously confirmed Jochen Hanebeck, Chief Executive Officer of Infineon Technologies, as the new ESIA President for a two-year mandate. Mr Hanebeck is succeeding NXP Semiconductors’ President and CEO Kurt Sievers.
Jochen Hanebeck has served as Infineon’s Chief Executive Officer since April 2022. Prior to being named CEO, he has been a member of the company’s Management Board as Chief Operations Officer since 2016. Mr Hanebeck began his career at Infineon Technologies in 1994, when it had still been part of Siemens. He began his tenure in DRAM technology devel- opment, and progressed through the Chip Card & Security Division, the Infineon Center of Excellence, the Automotive, Industrial and Multimarket Group, before being named Division President Automotive in 2008. He holds a degree in electrical engineering from RWTH Aachen University, Germany.
“It is a great honour to be named ESIA President”, Mr Hanebeck said. “The European semi- conductor industry has made great strides in the last couple of years, and their ubiquity in our day-to-day life has garnered them a lot of attention. I want to thank my predecessor Kurt Siev- ers for his leadership over the past two years, which saw the proposal, negotiation and adop- tion of the EU Chips Act. While its importance cannot be overstated, we cannot rest on these laurel’s. We must ensure that the European semiconductor industry continues to be recog- nised as a key industry in Europe. After all, technological progress is a result of innovation at our facilities.”
Looking ahead, he remarked: “The European semiconductor industry welcomes the ambitious framework created by the Chips Act. By means of its purposeful manufacturing incentives, its successful adoption is creating the right basis for the EU’s green and digital transitions. The industry is assuring that supply can keep up with the ever-growing global demand through numerous new facilities – in Crolles, Dresden, or Leixlip. Now, we must make sure that we populate our labs and fabs with the brightest minds and the best ideas. Having a sufficiently large talent pool at our disposal will be crucial to ensure Europe’s leadership in the technolo- gies of the present and future.”
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