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Siemens, Intel Foundry Advance Collaboration

04/30/2025 | Siemens Digital Industries Software
Siemens Digital Industries Software announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement leveraging the foundry’s leading-edge technologies for next-generation integrated circuits (IC) and advanced packaging.

Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation

04/25/2025 | Siemens
Siemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.

Siemens Extends Collaboration with TSMC to Advance Integrated Circuit and Systems Design

09/25/2024 | Siemens
Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications and innovative technology enablement for the foundry’s newest process technologies.

Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools

06/14/2024 | Siemens
Siemens Digital Industries Software today announced that, in collaboration with Samsung Foundry, they have developed compelling new capabilities for the manufacture of multi-die packaged designs at advanced nodes and achieved a host of new product certifications for many of Siemens’ industry-leading IC design and verification technologies.

Siemens, TSMC Collaborate to Help Mutual Customers Optimize Designs Using Foundry's Newest Advancements

09/29/2023 | Siemens
Siemens Digital Industries Software announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of multiple industry-leading Siemens EDA product lines for the foundry’s latest process technologies.
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