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From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation

05/06/2026 | I-Connect007
I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.

Vern Solberg: A Designer's Focus on High Density

04/30/2026 | Marcy LaRont, I-Connect007 Magazine
Vern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.

OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment

04/29/2026 | BUSINESS WIRE
OKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.

American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics

04/28/2026 | Shane Whiteside -- Column: American Made Advocacy
Current world events demonstrate the fragility of long-distance supply chains transiting multiple zones of conflict. The U.S. military is currently drawing down supplies of key munitions and other electronic systems at unprecedented rates.1Every one of those systems is powered by printed circuit boards. The American PCB industry has kept pace with peacetime demand for the defense industry, but will now be called upon to increase production to a wartime footing at rates not seen in decades.

EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates

04/21/2026 | Alison James and Chris Mitchell, Global Electronics Association
The European Commission has published a call for proposals under the European Defence Industry Programme (EDIP), and for European electronics manufacturers the message is clear: this is real money for real capacity, and PCBs and IC substrates are explicitly in scope. EDIP's Industrial Reinforcement Actions (IRA) dedicate €122.25 million to key electronic components, covering guidance electronics, propulsion electronics, RF and laser modules, multispectral cameras, avionics, PCBs and IC substrates, lithium-ion polymer batteries, power electronics, and critical semiconductor building blocks
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