-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating a Culture of Collaboration
PCB designers could learn quite a bit from NASA and the private companies that develop spacecraft: Every one of these vehicles is a testament to the value of collaboration among disparate stakeholders. Without a collaborative culture, the rocket might never get off the ground.
Breaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
Level Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
SAIC to Realign Organization to Optimize Strategic Pivots and Increase Organic Growth
December 12, 2023 | BUSINESS WIREEstimated reading time: 2 minutes
Science Applications International Corporation, a premier Fortune 500® technology integrator driving our nation's digital transformation across the defense, space, civilian and intelligence markets, announced it will reorganize its business, effective February 3, 2024. The reorganization will seek to accelerate sustainable organic growth, better align with SAIC’s four strategic pivots – portfolio, go-to-market, culture and brand – and ensure the company is focused and agile in allocating investments to maximize innovation, differentiation and long-term value creation.
The current Defense and Civilian Sector and National Security and Space Sector will be replaced by five new business groups – Army; Navy; Air Force and Combatant Commands; Space and Intelligence; and Civilian. The new Civilian group will encompass the current Civilian, Health and State and Local businesses. This flatter organization is designed to enhance customer intimacy for the executive leadership team, who will work closely with the new business group leaders to advance SAIC’s innovation and go-to-market strategy and drive improved cross-collaboration, business development and organic growth.
“SAIC has an unmatched history of partnering with our nation’s most critical mission-driven government customers and offering a best-in-class portfolio of capabilities. As we look ahead, we are becoming a more focused and growth-oriented SAIC that realizes the full potential of our differentiators, fueled by our innovation factory. This builds upon our recent decision to centralize our business development function to prioritize the quality and pace at which we execute our market opportunities,” said SAIC Chief Executive Officer Toni Townes-Whitley. “We are confident the company will continue to bring innovative solutions to market, further prioritize growth and deliver significant long-term value for our shareholders, customers and employees.”
Four of the five new business groups will be led by current SAIC senior vice presidents who will be promoted to executive vice president and report directly to Townes-Whitley beginning on February 3, 2024. Josh Jackson, Barbara Supplee, Vinnie DiFronzo and David Ray, will lead the Army, Navy, Air Force and Combatant Commands and Space and Intelligence business groups, respectively. An external search for the Civilian business group is being conducted to identify a strong best-of-market leader who will drive significant organic growth in this market. Bob Genter, President, Defense and Civilian Sector and Michael LaRouche, President, National Security and Space Sector will depart the company, effective as of February 2, 2024, to pursue opportunities outside of SAIC.
Townes-Whitley added, “On behalf of all of SAIC, I would like to thank Bob and Michael for their leadership and meaningful contributions to SAIC. I would also like to congratulate Josh, Barbara, Vinnie and David on their promotions. Each brings unique expertise and experience that I am confident will best position us to execute our strategic vision and support our customers as they navigate complex national security challenges.”
Suggested Items
Acculogic: Increase Test and Fault Coverage Through Interactive Tests
07/01/2024 | Acculogic Inc.New extended capabilities have been added to the proven integration package combining the FLS 980Dxi flying probe tester from Acculogic with the Embedded JTAG Solutions from GOEPEL electronic.
indie Semiconductor Introduces Class-leading Computer Vision Processor Family
06/28/2024 | BUSINESS WIREindie Semiconductor, Inc., an Autotech solutions innovator, announced the addition of a highly innovative iND880xx product line to its fast-growing vision processor portfolio, developed to address the demanding specifications of Advanced Driver Assistance Systems (ADAS) and driver viewing use cases, such as Surround View systems and Electronic Mirrors.
Renesas UPDATE: Regarding Acquisition of Stock of Altium Limited
06/28/2024 | RenesasAs announced in the press release “Regarding Acquisition of Stock of Altium Limited” issued on February 15, 2024, Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, entered into a Scheme Implementation Agreement for Renesas to acquire Altium Limited.
Bridging the Gap: Re-engaging Design and Manufacturing with Downstream
06/27/2024 | Andy Shaughnessy, Design007 MagazineAt PCB East in Boxborough, Massachusetts, I caught up with Joe Clark, co-founder of DownStream Technologies. In this interview, Joe walks us through how we got into our current situation, with design, fab, and assembly functioning in separate silos, and how DownStream and the IPC-2581 data format can help bridge this gap. He also discusses what we lost by moving from the captive model, and what we stand to gain by knocking down the walls between design and manufacturing.
IPC K-FEST Set to be IPC’s Landmark Event in Korea
06/27/2024 | IPCIPC K-FEST is set to be IPC’s landmark event in Korea on Oct 29, 2024, bringing together industry peers to celebrate the advancements and contributions that have shaped the landscape of electronics standards and technology.