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Suggested Items

Common vs. Differential Mode in Routing and Signal Integrity

06/11/2026 | Kristin Moyer, Sacramento State University and Global Electronics Association
In high-speed designs, the distinction between common-mode and differential-mode is becoming increasingly critical in PCB routing. While most designers are familiar with differential routing as a technique for certain signals on the PCB, many may not realize its underlying purpose. Differential routing is used to mitigate differential mode noise in the system. To understand this, we need a bit of electrical engineering background on signal and current flow in a system.

Elementary, Mr. Watson: Controlled Impedance—When ‘Connecting the Dots’ Stops Working

06/11/2026 | John Watson -- Column: Elementary, Mr. Watson
Signal integrity follows physics that are consistent, predictable, and fully explainable. But those rules don’t show up in the schematic. Instead, they live in the electromagnetic fields around the traces, in the stackup, and in the relationship between conductors and their return paths. The authors weren’t claiming black magic; they were calling out how it feels until you learn what’s going on. The fact that they said it more than 30 years ago only reinforces how fundamental and enduring these concepts really are.

Powering the Future: When Material Choice Defines RF Performance

06/10/2026 | Brian Buyea -- Column: Powering the Future
In RF and microwave design, deciding on which materials to use determines whether your design merely works or truly performs. Yet, designers too often fall back on material selection that is familiar, available, or “good enough.” However, once you move into higher frequencies, higher power densities, and tighter performance tolerances, “good enough” becomes the very thing that holds your design back. That’s where ceramic substrates become a fundamentally different approach to solving RF challenges.

Beyond Design: How Signals Survive the Hostile PCB Environment

06/03/2026 | Barry Olney -- Column: Beyond Design
Modern digital signals exhibit behavior more characteristic of RF waveforms than the slow logic transitions of the past. With fast rise times, a PCB is no longer a collection of copper traces, but a distributed electromagnetic system. Successful design isn’t about routing signals anymore; it’s about engineering transmission lines, preserving uninterrupted return‑current paths, and controlling the resonant structures that naturally form within the multilayer PCB.

Navigating the Hidden Hurdles: Mastering Return Path Discontinuities for Robust Signal Integrity

05/26/2026 | Stephen V. Chavez, Siemens EDA and PCEA
In the race toward higher bandwidth, tighter form factors, and faster time-to-market, engineering teams focus heavily on device performance, routing density, and advanced materials. Yet one of the most critical determinants of system success remains largely invisible—and too often underestimated: the integrity of the return path. Signal integrity (SI) failures rarely originate from the signal trace alone. More often, they stem from what designers don’t see—the disruption of the signal’s return path. These disruptions, known as return path discontinuities, are a leading cause of late-stage failures, unexpected EMI issues, and costly respins.
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