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The Shaughnessy Report: Winning the Signal Integrity Battle

09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy Report
When I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.

The Signal Integrity Issue: Design007 Magazine September 2025

09/09/2025 | I-Connect007 Editorial Team
As the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.

Beyond Design: Effective Floor Planning Strategies

08/20/2025 | Barry Olney -- Column: Beyond Design
Component placement on a printed circuit board is more involved than simply fitting parts into available space. It plays a pivotal role in determining the board’s overall manufacturability, performance, reliability, and cost. Poor placement can compromise even the most meticulously designed PCB. Effective component placement alleviates mechanical stress, promotes efficient thermal management, and helps prevent excessive heat buildup.

The Art and Science of PCB Floor Planning: A Comprehensive Guide

08/14/2025 | Cory Grunwald and Jeff Reinhold, Monsoon Solutions
PCB design is an intricate and crucial part of developing electronic products. One of the foundational stages of PCB design is floor planning, a phase where the placement of components and the flow of signals are meticulously mapped out. A good floor plan ensures that the PCB performs well, is easy to manufacture, and meets all mechanical and electrical requirements. We’ll explore the essential aspects of floor planning, from its objectives and process to the challenges that designers face.

Materials and Manufacturing for the AI Era: The Next PCB Frontier

08/08/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial Team
AI is pushing hardware to its limits, and the bottleneck isn’t design anymore—it’s materials. Next-generation AI servers aren’t just heavier on layer counts. They demand better materials to handle the speed, heat, and signal integrity requirements of 400G, 800G, and even 1.6T Ethernet systems. Many server motherboards are already 32–36 layers. For the next wave of 1.6T-capable boards,  expect 40–50 layers, which must maintain high-frequency performance without degrading signal quality.
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