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Keysight, KD Partner to Advance Multigigabit Optical Automotive Ethernet Testing with New Signal Analysis Capability

01/30/2025 | Keysight Technologies
Keysight Technologies, Inc. and KD, Inc., a fabless semiconductor company, have collaborated to create a comprehensive test for Multigigabit Optical Automotive Ethernet physical layer.

Beyond Design: Electro-optical Circuit Boards

01/22/2025 | Barry Olney -- Column: Beyond Design
Predicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.

Global PCB Connections: The Future of HDI PCBs

01/16/2025 | Jerome Larez -- Column: Global PCB Connections
High-density interconnect (HDI) printed circuit boards (PCBs) transform modern electronics by providing increased functionality, reduced sizes, and enhanced performance in complex designs. They do so by using advanced techniques, such as finer line and space definitions, microvias, and additional board layers. Specialized via structures—namely blind, buried, and stacked vias—offer complex routing while conserving space. This allows for the development of highly compact electronic devices. This article delves into HDI PCB technology, the function and benefits of blind, buried, and stacked vias, and their impact on PCB performance and design.

Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup

01/07/2025 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.

Fresh PCB Concepts: PCB Stackup Strategies—Minimizing Crosstalk and EMI for Signal Integrity

01/09/2025 | Team NCAB -- Column: Fresh PCB Concepts
PCBs are critical components in almost every modern electronic device, but their design goes far beyond routing signals from one point to another. The stackup of a PCB (the arrangement of its layers) has a significant impact on signal integrity, electromagnetic interference (EMI), and crosstalk. The complexity of these issues grows exponentially as designs increase in speed, frequency, and complexity.
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