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Yannick Green Joins Technica USA as Business Development/Account Manager for Northern California and Northern Nevada

07/07/2025 | Technica USA
Technica USA is proud to announce that industry veteran Yannick Green has rejoined Team Technica as Business Development/Account Manager, supporting both supply partners and PCBA customers across Northern California and Northern Nevada.

EU Defence Electronics Ecosystem Highlighted in Brussels

07/01/2025 | I-Connect007 Editorial Team
In this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.

Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry

06/25/2025 | Global Electronics Association
Today begins a new chapter for IPC as it officially becomes the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “Better electronics for a better world,” the Global Electronics Association (electronics.org) is dedicated to enhancing supply chain resilience and promoting accelerated growth through engagement with more than 3,000 member companies, thousands of partners, and dozens of governments across the globe.

Flex CEO Sees US Manufacturing Resurgence

06/18/2025 | I-Connect007
In a June 16 interview on Bloomberg Open Interest, Flex CEO Revathi Advaithi said the supply chain is already shifting, with more goods now being manufactured in the U.S.

The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics 

06/18/2025 | Chris Mitchell -- Column: The Government Circuit
I had the privilege of attending the June 3 opening ceremony of AT&S’s HTB3 facility in Leoben, Austria—a milestone moment for Europe’s electronics ecosystem. HTB3 is now the first and only facility in Europe capable of both developing and producing high-performance IC substrates—the advanced platforms that allow powerful chips to connect, process, and function. As demand for AI, 5G, and other cutting-edge technologies grows, so too does the need for sophisticated substrates like those HTB3 will produce.
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