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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Cetec ERP to Revolutionize Manufacturing Efficiency at Design 2 Part Show in Texas
December 15, 2023 | Cetec ERPEstimated reading time: 1 minute
Cetec ERP is pleased to announce plans to exhibit its industry-leading software tailored to meet the unique needs of machine shops and metal fabrication businesses at the Design 2 Part Show, scheduled to take place March 13-14, 2024 in Irving, TX.
Cetec ERP offers tailored solutions for machine shops and metal fabrication, providing a comprehensive suite of features to enhance operational efficiency. With intelligent scheduling capabilities, the software optimizes production timelines, ensuring on-time deliveries through streamlined resource allocation. The advanced inventory management system offers real-time visibility, minimizing the risk of stockouts by ensuring accurate stock tracking. Powerful job costing tools facilitate accurate production cost calculations, enabling better decision-making and cost control.
The seamless integration of barcode scanning enhances data accuracy and expedites data entry processes, reducing human errors in critical processes. For shop floor operations, Cetec ERP provides real-time data access, enabling efficient work order management and improving overall production workflow. The robust quality management module ensures adherence to stringent quality standards, ultimately enhancing the delivery of superior products and customer satisfaction.
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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
LITEON Joins DJBIC Indices and Top 1% in S&P Sustainability Yearbook 2026
05/11/2026 | LITEON TechnologyLITEON Technology announced that it recorded an ESG score of 91 in the S&P Global 2025 Corporate Sustainability Assessment (CSA), representing its best performance to date since joining the Dow Jones Best‑in‑Class Indices (DJBIC, formerly DJSI) framework in 2010 and marking its 15th consecutive year of inclusion.
Zhen Ding Becomes Taiwan’s Only PCB Company Listed in Both DJ BIC Indices
05/06/2026 | Zhen DingS&P Dow Jones Indices recently announced the annual rebalancing results of the Dow Jones Bestin-Class Indices (DJ BIC).
Global Electronics Association and FED Open Call for Abstracts for 2027 Pan-European Design Conference
04/30/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.