Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Ericsson, Nokia, ANDREW, and Huawei Take Top Spots in ABI Research’s DAS/DRS Vendors Competitive Ranking

05/07/2025 | ABI Research
Driven by the growing demand for seamless connectivity and 5G readiness, the Distributed Antenna System (DAS) and Distributed Radio System (DRS) market is shifting toward more intelligent, scalable solutions tailored to diverse enterprise environments.

Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications

05/01/2025 | Cadence Design Systems
Cadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).

Keysight EDA, Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions

04/30/2025 | BUSINESS WIRE
Keysight Technologies, Inc. announced a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a cutting-edge innovation aimed at improving high-performance packaging solutions for artificial intelligence (AI) and data center markets in addition to the support of Intel 18A process node.

Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs

05/01/2025 | Team NCAB -- Column: Fresh PCB Concepts
As a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.

New RF Materials Offer Options for RF Designers

04/29/2025 | Andy Shaughnessy, Design007 Magazine
The RF materials arena has changed quite a bit in the past decade. The newest thermoset laminates boast performance numbers that are almost competitive with PTFE, but without the manufacturability challenges. At IPC APEX EXPO this year, I spoke with Brent Mayfield, business development manager at AGC Multi Material America. Brent walked through some recent innovations in RF materials, advances in resin systems, and the many design trade-offs for RF engineers to consider for each material set.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in