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Würth Elektronik Expands Signal LED Product Range

11/21/2024 | Wurth Electronics
Würth Elektronik expands its proven LED product series WL-SMCW and WL-SMCC with white LEDs in 0603 and 0402 packages.

Advanced Packaging: Preparation is Now

11/20/2024 | Nolan Johnson, SMT007 Magazine
A new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.

PCB007 Magazine: November 2024—Engineering Economics

11/18/2024 | I-Connect007 Editorial Team
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.

TI Accelerates Delivery to European Customers; Opens New Product Distribution Center Near Frankfurt, Germany

11/14/2024 | Texas Instruments
Texas Instruments (TI) announced the opening of its new, state-of-the-art product distribution center in Dreieich, Germany, outside of Frankfurt.

Agileo Automation Launches E84 PIO Box at SEMICON Europa

11/12/2024 | Agileo Automation
Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor equipment manufacturers, today launches the E84 PIO Box at Booth #C2848.
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