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Connect the Dots: Total Value Manufacturing Solutions

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In my last column, I discussed total value management, an approach to the quality-versus-cost balancing act that integrates components of total quality management (TQM) and Lean manufacturing. Like those other methodologies, total value management prizes customer focus, continuous improvement, and employee empowerment.

Lockheed Martin Ships 2nd Aegis Vessel Set with AN/SPY-7 Radar to Japan

03/16/2026 | Lockheed Martin
Lockheed Martin, successfully delivered the second Aegis System Equipped Vessel (ASEV) shipset of AN/SPY-7(V)1 radar equipment to the Japan Ministry of Defense (JMOD).

Henger Announces Delivery of 400 Plasma Equipment Units and Launch of Their Second Plant

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Zhuhai Henger Microelectronics Equipment Co., Ltd. announced the successful delivery of its 400th PCB plasma equipment unit and the official inauguration of the plasma workshop at its second plant on November 11. These milestones mark a significant advancement in the company’s technological development and production capacity.

PDN Optimization: Balancing Performance and Cost in SoC Designs

10/22/2025 | Zach Caprai. Siemens EDA
This article demonstrates advanced PDN optimization techniques through a real-world case study of AMD’s Versal adaptive SoC platform. Using the VCK190 evaluation kit featuring the Versal AI Core series VC1902 device, I’ll explore how effective PDN design and optimization can help meet demanding technical specifications while addressing essential business goals.

Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025

09/25/2025 | Empower Semiconductor
Empower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.
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