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iNEMI HDI Socket Warpage Prediction and Characterization Webinar

11/15/2024 | iNEMI
High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.

Designers Notebook: Implementing HDI and UHDI Circuit Board Technology

10/23/2024 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.

Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle

08/06/2024 | Thomas Sanders, Seth Gordon, Reza Ghaffarian, Jet Propulsion Laboratory
Current trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.

IDTechEx Asks if Silicon Anodes Are the Key to Mass EV Adoption

05/24/2024 | PRNewswire
Maximizing energy density has been one key area of focus in electric vehicle battery development. Optimizations in cell and battery pack designs, alongside the use of higher nickel NMC and NCA cathodes, have led to steady improvement in battery energy density over the past 10-15 years.

High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership

05/20/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member. 
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