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HDPUG: 30 Years of Collaboration
January 1, 2024 | Madan Jagernauth, Marketing Directory HDPEstimated reading time: Less than a minute
The High Density Packaging User Group International Inc. (HDP) and IPC have partnered successfully for many years. The groups signed an MoU in 2020 to strengthen this relationship, increase technical collaboration between the groups, and provide a mutual path toward emerging and disruptive high-density interconnect (HDI) technologies.
What is HDP?
HDP, founded in 1993, is a nonprofit trade organization that offers memberships to companies involved in the electronics manufacturing industry. HDP's mission is to drive innovations in the electronics industry, reducing cost and time to market through active collaborations that solve critical and emerging problems. HDP is focused on the characterization and reliability of electronic assemblies and sub-assemblies, focusing on new technologies.
This article originally appeared in the fall 2023 issue of IPC Community. To learn more about HDP’s area of focus and process, click here.
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iNEMI HDI Socket Warpage Prediction and Characterization Webinar
11/15/2024 | iNEMIHigh-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.
Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
10/23/2024 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.
Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
08/06/2024 | Thomas Sanders, Seth Gordon, Reza Ghaffarian, Jet Propulsion LaboratoryCurrent trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.
IDTechEx Asks if Silicon Anodes Are the Key to Mass EV Adoption
05/24/2024 | PRNewswireMaximizing energy density has been one key area of focus in electric vehicle battery development. Optimizations in cell and battery pack designs, alongside the use of higher nickel NMC and NCA cathodes, have led to steady improvement in battery energy density over the past 10-15 years.
High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership
05/20/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member.