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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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HDPUG: 30 Years of Collaboration
January 1, 2024 | Madan Jagernauth, Marketing Directory HDPEstimated reading time: Less than a minute
The High Density Packaging User Group International Inc. (HDP) and IPC have partnered successfully for many years. The groups signed an MoU in 2020 to strengthen this relationship, increase technical collaboration between the groups, and provide a mutual path toward emerging and disruptive high-density interconnect (HDI) technologies.
What is HDP?
HDP, founded in 1993, is a nonprofit trade organization that offers memberships to companies involved in the electronics manufacturing industry. HDP's mission is to drive innovations in the electronics industry, reducing cost and time to market through active collaborations that solve critical and emerging problems. HDP is focused on the characterization and reliability of electronic assemblies and sub-assemblies, focusing on new technologies.
This article originally appeared in the fall 2023 issue of IPC Community. To learn more about HDP’s area of focus and process, click here.
Suggested Items
SMTA: Pan Pacific Strategic Electronics Symposium Program Finalized
12/17/2024 | SMTASMTA announced that the program is finalized for the 29th Annual Pan Pacific Strategic Electronics Symposium. The event will take place from January 27 to 30, 2025 at the Sheraton Maui Resort on Maui, Hawaii.
China Overtakes Germany and Japan in Robot Density
11/22/2024 | IFRChina's adoption of robots continues at a rapid pace: The country has surpassed Germany and Japan in the ratio of robots to factory workers, taking third place in the world in 2023.
iNEMI HDI Socket Warpage Prediction and Characterization Webinar
11/15/2024 | iNEMIHigh-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.
Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
10/23/2024 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.
Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
08/06/2024 | Thomas Sanders, Seth Gordon, Reza Ghaffarian, Jet Propulsion LaboratoryCurrent trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.