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Facing the Future: Investing in R&D to Stay Competitive

06/10/2025 | Prashant Patel -- Column: Facing the Future
In the PCB industry, staying ahead of the competition requires more than production efficiency; it demands continuous innovation, a firm commitment to research and development (R&D), and a proactive approach to emerging technologies. Companies that invest in R&D are better positioned to develop advanced solutions, enhance product reliability, and adapt to the dynamic demands of the electronics industry.

UHDI Fundamentals: UHDI Drives Unique IoT Innovation—Smart Homes

06/03/2025 | Anaya Vardya, American Standard Circuits
The combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications.

Corning Collaborates with Broadcom to Accelerate AI Data Center Processing Capacity

05/14/2025 | BUSINESS WIRE
Corning Incorporated, a world leader in glass science and optical physics, today announced a collaboration with Broadcom Incorporated, a leading supplier in the semiconductor field, on a co-packaged optics (CPO) infrastructure that will significantly increase processing capacity within data centers.

Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating

04/15/2025 | Michael Carano -- Column: Trouble in Your Tank
There are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.

Real Time with... IPC APEX EXPO 2025: Advancements for Flexible Circuit Technologies

04/11/2025 | Real Time with...IPC APEX EXPO
Mark Finstad and Chris Clark from Flexible Circuit Technologies discuss their new marketing campaign for catheter circuits, featuring larger formats and advanced specifications. They explain the development of in-house materials for high-density circuits, enhancing cost competitiveness. They highlight the opening of a new facility in China for advanced assembly services, along with focused training sessions to fill industry education gaps and promote early customer engagement for better project outcomes.
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