Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

ispace Completes Success 8 of Mission 2 Milestones

06/02/2025 | ispace
ispace, inc. (ispace) (TOKYO: 9348), a global lunar exploration company, announced that the RESILIENCE lunar lander has successfully completed all orbital maneuvers while in lunar orbit and is now being prepared for its landing attempt on June 6, 2025.

Airbus to Design and Build ESA’s ExoMars Rover Lander Platform

03/31/2025 | Airbus
Airbus has been selected by the European Space Agency (ESA) and Thales Alenia Space (TAS - a joint venture between Thales (67%) and Leonardo (33%)), the ExoMars industrial prime contractor, to build key systems for the ExoMars lander that will safely place the Rosalind Franklin rover on the surface of the Red Planet.

Curtiss-Wright Awarded $27M Contract to Provide Aircraft Handling Systems and Support for U.S. Navy Constellation Class Frigates

01/24/2025 | Curtiss-Wright Corporation
Curtiss-Wright Corporation announced that it has received a $27 million contract award from the Canadian Commercial Corporation (CCC) for the supply of Aircraft Ship Integrated Securing and Traversing (ASIST) systems.

NASA Plans to Assign Missions for Two Future Artemis Cargo Landers

12/02/2024 | NASA
NASA, along with its industry and international partners, is preparing for sustained exploration of the lunar surface with the Artemis campaign to advance science and discovery for the benefit of all. As part of that effort, NASA intends to award Blue Origin and SpaceX additional work under their existing contracts to develop landers that will deliver large pieces of equipment and infrastructure to the lunar surface.

Japan’s First Moon Lander Touches Down with Renesas’ Rad-Hard ICs on Board

01/22/2024 | BUSINESS WIRE
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that its radiation-hardened (rad-hard) ICs were onboard the Smart Lander for Investigating Moon (SLIM) spacecraft that successfully touched down on the Moon’s low latitude area on January 20, Japan Standard Time.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in