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SIA Commends CHIPS Act Incentives for Coherent, SkyWater Technology, X-FAB

12/09/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce, Coherent, SkyWater Technology, and X-FAB.

SkyWater Technology to Build $1.8B Semiconductor Fab at Purdue's Discovery Park District

07/21/2022 | Purdue University
SkyWater Technology announces that it plans to open a $1.8 billion state-of-the-art semiconductor manufacturing facility in Discovery Park District at Purdue University marks a huge step forward for the American semiconductor industry, Purdue’s thriving innovation district and the university’s continued emergence as one of the principal drivers of the Indiana economy.

CAES, SkyWater to Expand U.S. Strategic Radiation Hardened Semiconductor Platform

06/21/2021 | CAES
CAES, a pioneer in advanced electronics design and manufacturing of secure and trusted solutions for aerospace and defense, announced an agreement with SkyWater Technology to advance the design and manufacturing of SkyWater’s strategic radiation hardened (RadHard) integrated circuits (ICs) and systems-in-package (SiPs).

SkyWater and MIT Begin Second Phase of DARPA-funded 3DSoC Program

08/21/2020 | Business Wire
SkyWater Technology, the trusted technology realization partner, announced the DARPA Three Dimensional Monolithic System-on-a-Chip (3DSoC) program, in collaboration with Massachusetts Institute of Technology (MIT), has entered its second phase.

Lincoln Lab Transfers Integrated Circuit Process to Industry

06/26/2020 | MIT News Office
High levels of radiation, such as those occurring naturally in space and at high altitudes on Earth, can wreak havoc on electronics. MIT's Lincoln Laboratory has developed a unique process for making integrated circuits resistant to damage and malfunction caused by extreme radiation levels.
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