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Design007 Magazine's January 2024 Issue Released
January 9, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Manufacturing Know-how
Our cover image for this month’s issue of Design007 Magazine is a great representation of the PCB development process where design, fabrication, and assembly are all intertwined. But designers, sitting at the front end of the entire development cycle, must have more than a passing understanding of the processes downstream from them. Some analysts estimate that 70% of the cost of the final board is determined during the design cycle. That’s a lot of responsibility.
So, this month, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
Suggested Items
All Flex Solutions Certified to ANSI/ESD S20.20-2021
09/19/2024 | All Flex SolutionsFactories that handle ESD-sensitive components at All Flex Solutions have earned certification to ANSI/ESD S20.20-2021 Electrostatic Discharge Control Program.
Augering in on Dispensing
09/19/2024 | Nolan Johnson, PCB007In this interview with Sunny Agarwal, a senior applications and process engineer at Camalot Dispensers R&D, we talk about the choice between traditional methods and jet dispensing. Sunny says it depends on material properties, especially viscosity. Dispensing is very specific to application requirements, and excels in scenarios involving tall components, where precise droplet placement is crucial.
IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
09/16/2024 | IPCThe increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium
09/11/2024 | StratEdgeStratEdge Corporation announces that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France from September 24-27, and booth 313 at IMAPS International Symposium for Microelectronics being held at the Encore Boston Harbor in Everett, Massachusetts, on October 1-2.
Tata Electronics, ASMPT Partner for India Semiconductor Growth
09/10/2024 | PRNewswireIn a significant step towards accelerating its readiness for its semiconductor assembly and test facilities in Vemagal, Karnataka and Jagiroad, Assam, Tata Electronics signs a Memorandum of Understanding (MOU) with ASMPT Singapore to collaborate on establishing semiconductor assembly equipment infrastructure and solutions.