Beyond Design: Skip-layer Routing—The Waveguide Structure That Makes 224G Possible
Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets
Elementary, Mr. Watson: Builders of the Dream
Manufacturing Know-how
Our cover image for this month’s issue of Design007 Magazine is a great representation of the PCB development process where design, fabrication, and assembly are all intertwined. But designers, sitting at the front end of the entire development cycle, must have more than a passing understanding of the processes downstream from them. Some analysts estimate that 70% of the cost of the final board is determined during the design cycle. That’s a lot of responsibility.
So, this month, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
