Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Hentec Industries/RPS Automation Receives Order from Fisk Alloy Incorporated for Photon Steam Aging System
January 11, 2024 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Fisk Alloy Incorporated has purchased a Photon steam aging system. The Photon steam aging system is used for accelerated life testing to simulate elongated storage conditions for high-reliability applications.
These steam aging systems complement the Odyssey component lead tinning machines specifically designed to perform component re-tinning, tin whisker mitigation, gold removal and BGA de-balling for high reliability and military application in accordance with all relevant GEIA-STD-0006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.
Share on:
Suggested Items
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
BEST Inc. Launches Component Lead Tinning Services
02/14/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce the launch of its new lead tinning services, designed specifically for electronic components.
Circuit Technology Center Announces Expanded Tinning Services Capacity
09/16/2024 | Circuit Technology CenterCircuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning.
Hentec/RPS to Exhibit Vector Selective Soldering and Odyssey Lead Tinning Systems at IPC APEX EXPO 2024
04/04/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability testing equipment, is pleased to announce it will exhibit its Vector 300 selective soldering and Odyssey 925 lead tinning systems at the upcoming IPC EXPO 2024.
Astranis Space Technologies Orders Hentec Industries/RPS Automation Odyssey Component Lead Tinning System
12/13/2023 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Astranis Space Technologies Corp has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.