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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 12, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

Welcome back, readers! Glad to see you. I hope you had plenty of rest over the holidays and you don’t need a vacation from your vacation. Why do Americans try to fit in so much activity during a vacation?
This week, our five must-reads include articles and news items on global fab trends and challenges, a breakdown of M&A activity in 2023, Ventec’s move into the equipment arena, the opportunities that arise from designer-fabricator communication early in the design cycle, and a new kind of AOI that’s driven by an AI neural network.
It’s been great having a few weeks of downtime, but we’re getting back to work and that feels good too. Have a good weekend!
Punching Out: 2023 PCB and EMS M&A Review
Published January 9
During 2023, we saw quite a few mergers in the PCB and EMS segments. In this column, Tom Kastner breaks down these mergers and explains some of the drivers behind them. One common theme seems to be companies outside the U.S. acquiring manufacturers to gain greater access to U.S. markets. And he sees more mergers for 2024.
Beyond Blueprints: Early Involvement Shapes Superior Fab Outcome
Published January 11
As technology advances and board features shrink, the need for communication between designers and manufacturers becomes more critical. Léa Maurel of ICAPE explains how early involvement with your fabricator can save yourself—and everyone downstream—a whole parcel of problems, from floorplanning through component placement.
Ventec International: Growth, Changes, and a New Direction
Published January 11
Suppliers often expand into a new type of product. This works best when the move feels natural and organic, complementing the company’s existing product lines. As Ventec International COO Mark Goodwin explains in this interview, the company’s recent drive into selling equipment is one such example. Every company wants to expand, but smart expansion is key.
A New Generation of AI AOI
Published January 10
Delvitech CEO Roberto Gatti looked at the AOI equipment market and realized that it was time for something completely different, as Eric Idle would say. His Swiss company entered this crowded field with an AOI system driven by an AI neural network. As he explains, “The machine learns the component, and while it learns, it already understands the best way to inspect it.” Expect to see more AI in every area of PCB manufacturing and design.
Elevating Fabrication: Investing in High-tech Equipment, Processes, and Labor
Published January 11
As chief transformation officer at Amitron, Aidan Salvi spent a good chunk of the past few years visiting fabricators in North America, Europe, and Asia. We asked Aidan to discuss what he learned in his travels. He points out that companies around the globe are ready to invest in new technologies, particularly in the highest levels of technology.
Suggested Items
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
NVIDIA RTX PRO 6000 Shipments Expected to Rise Amid Market Uncertainties
06/24/2025 | TrendForceThe NVIDIA RTX PRO 6000 has recently generated significant buzz in the market, with expectations running high for strong shipment performance driven by solid demand.
Green Circuits Boosts Test Capacity with New Takaya APT-1600FD System
06/24/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce the purchase of its fourth Takaya APT-1600FD Double-sided Flying Probe Test System.