The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 12, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Welcome back, readers! Glad to see you. I hope you had plenty of rest over the holidays and you don’t need a vacation from your vacation. Why do Americans try to fit in so much activity during a vacation?
This week, our five must-reads include articles and news items on global fab trends and challenges, a breakdown of M&A activity in 2023, Ventec’s move into the equipment arena, the opportunities that arise from designer-fabricator communication early in the design cycle, and a new kind of AOI that’s driven by an AI neural network.
It’s been great having a few weeks of downtime, but we’re getting back to work and that feels good too. Have a good weekend!
Punching Out: 2023 PCB and EMS M&A Review
Published January 9
During 2023, we saw quite a few mergers in the PCB and EMS segments. In this column, Tom Kastner breaks down these mergers and explains some of the drivers behind them. One common theme seems to be companies outside the U.S. acquiring manufacturers to gain greater access to U.S. markets. And he sees more mergers for 2024.
Beyond Blueprints: Early Involvement Shapes Superior Fab Outcome
Published January 11
As technology advances and board features shrink, the need for communication between designers and manufacturers becomes more critical. Léa Maurel of ICAPE explains how early involvement with your fabricator can save yourself—and everyone downstream—a whole parcel of problems, from floorplanning through component placement.
Ventec International: Growth, Changes, and a New Direction
Published January 11
Suppliers often expand into a new type of product. This works best when the move feels natural and organic, complementing the company’s existing product lines. As Ventec International COO Mark Goodwin explains in this interview, the company’s recent drive into selling equipment is one such example. Every company wants to expand, but smart expansion is key.
A New Generation of AI AOI
Published January 10
Delvitech CEO Roberto Gatti looked at the AOI equipment market and realized that it was time for something completely different, as Eric Idle would say. His Swiss company entered this crowded field with an AOI system driven by an AI neural network. As he explains, “The machine learns the component, and while it learns, it already understands the best way to inspect it.” Expect to see more AI in every area of PCB manufacturing and design.
Elevating Fabrication: Investing in High-tech Equipment, Processes, and Labor
Published January 11
As chief transformation officer at Amitron, Aidan Salvi spent a good chunk of the past few years visiting fabricators in North America, Europe, and Asia. We asked Aidan to discuss what he learned in his travels. He points out that companies around the globe are ready to invest in new technologies, particularly in the highest levels of technology.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.