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Foxconn Joins Open Invention Network Community
January 16, 2024 | GlobeNewswireEstimated reading time: 1 minute
Open Invention Network (OIN), the organization formed to safeguard open source and now the largest patent non-aggression community in history, announced that Hon Hai Technology Group (Foxconn) has joined as a community member. As a leading technological solution provider and the world’s largest electronics manufacturer, Foxconn is reinforcing its commitment to open source.
“Advances in design and manufacturing propel ongoing innovation within the electronics and components industries. A key driver of these new capabilities is open source technology. Open source enables companies to share foundational technology while they invest in powerful, differentiating features and capabilities higher in the technology stack,” said Keith Bergelt, CEO of Open Invention Network. “As a global leader in the development and manufacturing of electronics and technology solutions, we are pleased that Foxconn is committed to patent non-aggression in open source.”
“Foxconn continuously looks for ways to integrate advances into the design and manufacturing of smart consumer electronics, cloud and networking equipment, computing devices and components, among others,” said Mick Lim, Director of Foxconn IP Affairs Division. “We are pleased to join the Open Invention Network and support its role in protecting open source.”
As a community, OIN members practice patent non-aggression in core Linux and adjacent open source technologies by cross-licensing Linux System patents to one another on a royalty-free basis.
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AV, OpenJAUS Announce Collaboration for Autonomous Uncrewed System (UxS) Interoperability
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
AMD, OpenAI Announce Strategic Partnership to Deploy 6 Gigawatts of AMD GPUs
10/06/2025 | OpenAIAMD and OpenAI today announced a 6 gigawatt agreement to power OpenAI’s next-generation AI infrastructure across multiple generations of AMD Instinct GPUs. The first 1 gigawatt deployment of AMD Instinct MI450 GPUs is set to begin in the second half of 2026.
AMD Acquires Brium to Strengthen Open AI Software Ecosystem
06/05/2025 | AMDAt AMD, we’re committed to building a high-performance, open AI software ecosystem that empowers developers and drives innovation. Today, we’re excited to take another step forward with the acquisition of Brium, a team of world-class compiler and AI software experts with deep expertise in machine learning, AI inference, and performance optimization.