-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Yamaha Robotics Introduces Solder-paste Inspection System with Advanced Features and Flexibility
January 16, 2024 | Yamaha Robotics SMT SectionEstimated reading time: 1 minute

Yamaha Robotics SMT Section has revealed its latest inline solder-paste inspection system, the VP-01G-Y, with advanced features to raise surface-mount production quality and productivity.
Consolidating high-speed and high-resolution inspection capabilities in a single unit, the VP-01G-Y uses advanced algorithms in 2D and 3D modes to aid focusing and contour extraction. Analysis includes 3D solder-paste and adhesive inspection, foreign-matter detection, and board warpage, to assist screen-printing, dispensing, and component-placement processes. The system compensates for board warping and handles inspection of flexible PCBs. Advanced features include a ring light source that provides 360° illumination to ensure reliable inspection and accurate three-dimensional measurements.
The one-head design allows continuous, changeover-free inspection, with 25µm, 20µm, or 15µm lens and software-controlled multiple-resolution switching for additional settings. The resolution is switchable for each visual field, enabling optimum throughput when inspecting boards with areas of high interconnect density and mixed-size parts including ultra-small components down to 0201 and 03015 SMD chips.
Engineered to integrate fully with the 1 STOP SMART SOLUTION for surface-mount assembly and YSUP intelligent factory software, the VP-01G-Y shares data extensively with upstream and downstream equipment. The system responds automatically to setup-change instructions according to the PCB identity, feeds-back inspection results to enhance print quality, and feeds-forward bad-mark data to minimize component-mounting cycle time.
The VP-01G-Y adds powerful data-driven capabilities to surface-mount assembly within a space-efficient footprint of 938mm x 1191mm. The board-size range, from 50mm x 50mm to 510mm x 510mm, fulfils production demands across diverse sectors including automotive, medical, industrial, and consumer electronics manufacturing.
Suggested Items
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
04/28/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
Real Time with... IPC APEX EXPO 2025: TRI Innovation—Transforming Semiconductor Inspection with AI Technology
04/25/2025 | Real Time with...IPC APEX EXPONolan Johnson talks with David Chiu, USA Sales Manager for TRI Innovation. TRI uses advanced technology to tackle challenges in inspecting tiny components. Their AI programming reduces coding time by 75%, enhancing efficiency in inspections. Collaborating with Nvidia, TRI integrates GPU technology to improve product development and encourages customers to share data for better AI performance.
TRI at SMTA Wisconsin Expo 2025
04/24/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join the SMTA Wisconsin Expo 2025.
Koh Young Installs 24,000th Inspection System at Fabrinet Chonburi
04/23/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at Fabrinet Chonburi in Thailand. This advanced facility is operated by Fabrinet Co., Ltd., a global provider of advanced manufacturing services, specializing in complex optical, electro-optical, and electronic products
The Future of Advanced Packaging Inspection Is X-ray
04/22/2025 | David Kruidhof and Kevin Jan, Comet YxlonDriven by smartphones, high-performance computers, and artificial intelligence, the global demand for high-end computing power is constantly rising. The industry is also facing demands for miniaturization, which creates the need for ever-smaller defect recognition. The semiconductor industry has been identifying and solving these challenges for decades using various optical inspection and SEM tools.