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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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IPC’s Advanced PCB Design Concepts Training Course
January 19, 2024 | IPCEstimated reading time: Less than a minute
The Advanced PCB Design Concepts course, 6:30 to 8:30 p.m. EDT March 18 to May 15, 2024, with virtual classes held on Mondays and Wednesdays, will start with the design of HDI and advanced packaging concepts. This will be followed by embedded component design and the students will see how concepts from HDI are used in the implementation of embedded components. Next, concepts necessary for the design of wearable electronics and how the use of concepts from HDI and Embedded are necessary to achieve the small size and light weight of wearable electronics.
The course covers the skills necessary to create IPC-compliant PCB designs with:
- Advanced or complex packaging
- Reduced available board area
- Non-orthogonal placement and routing
- Non-standard board outline geometry
- Non-standard board mounting
- Advanced board materials
- Embedded components
- Cavities to reduce the overall volume/skyline of the design
- Human interface/wearable technology
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The ICAPE Group Announces a 13% Growth in Revenue to €51.1M for Q1 2025
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indie Semiconductor Reports Q1 2025 Results
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