Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

SEMI Reports 13% Year-on-Year Growth in Global Silicon Wafer Shipments in Q1 2026

04/30/2026 | SEMI
The SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025.

TRI Launches New Wafer Inspection and Metrology Platform

04/28/2026 | TRI
Test Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series.

Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains

04/22/2026 | PRNewswire
Silicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.

Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging

04/20/2026 | Marcy LaRont, I-Connect007
The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.

Coherent Advances 10kV SiC Epitaxy for AI Datacenters

04/13/2026 | Coherent
Coherent Corp., a global leader in photonics, announced advancements in its silicon carbide (SiC) epitaxy capabilities, enabling power devices up to 10kV for next-generation AI datacenter and industrial power applications.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in