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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Molex Completes Acquisition of Teramount Ltd.
May 7, 2026 | PRNewswireEstimated reading time: 1 minute
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
"Teramount's passive, detachable coupling approach supports large assembly tolerances and semiconductor‑grade wafer‑level processes—filling a critical gap in the optical stack," said Aldo Lopez, president, Datacom Solutions, Molex. "By integrating this unique technology into our optical interconnect portfolio, Molex offers a more seamless path from early-stage prototypes to high-volume CPO and other silicon photonics architectures required for the AI era."
Teramount will continue to operate as a design and engineering hub in Jerusalem, supported by Molex's global optical capabilities. It will become part of the Optical Connectivity segment within the Optical Solutions Business at Molex.
Financial terms of the transaction were not disclosed.
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Molex to Acquire Teramount to Accelerate Scalable Co-Packaged Optics Adoption
04/15/2026 | PRNewswireMolex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications.