Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
Elementary, Mr. Watson: Why Your PCB Looks Like a Studio Apartment
The Shaughnessy Report: A Plan for Floor Planning
IPC APEX EXPO 2024 Offers More Than 100 Technical Sessions in Electronics Manufacturing
January 23, 2024 | IPCEstimated reading time: 1 minute
The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO 2024, features cutting-edge technical content directly influencing the $2 trillion global electronics manufacturing industry. Attendees will have more than 100 opportunities to update their technical knowledge during sessions at IPC APEX EXPO 2024 from April 6-11, 2024, in Anaheim, Calif.
“Our technical conference and professional educational program feature the highest quality technical content from technical experts representing three continents,” said Julia Gumminger, IPC manager, professional development and events. “Industry experts representing global enterprises and small companies will present novel, unpublished data and share their innovations in a wide range of fundamental and emerging topics.”
Unique to 2024, IPC APEX EXPO will host the Electronic Circuits World Convention (ECWC16) Technical Conference, an expanded, global technical symposium featuring more than 70 presentations over nine technical tracks: PCB Fabrication and Materials; Design; Assembly Process and Materials; HDI uHDI and Substrates; Sustainability for Electronics; High Reliability; Factory of the Future; Emerging Technologies; and Quality, Reliability, Test and Inspection.
Authors from around the globe will present their new, unpublished results, to share developments and innovations in materials, techniques, processes across the spectrum of the electronics manufacturing supply chain. Two special technical sessions will feature invited speakers on advanced packaging and e-mobility and EV automotive. The technical conference will be held April 9-11.
IPC APEX EXPO 2024 will provide more than 30 professional development course sessions delivered by technical experts, corporate technologists, and peer leaders in the industry. The professional development courses, covering such topics as artificial intelligence, PWB design engineering, 3-D printing, Li-ion battery technology, and proactive design methods for approaching zero-field failures, will provide attendees the opportunity to build their professional and technical skills and increase their knowledge in techniques, materials, and trends in all aspects of the industry. Professional development courses will be held April 7-8, and April 11.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Eltek Ltd. Reports Strong Second-Quarter 2025 Results
08/14/2025 | PR NewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the quarter ended June 30, 2025.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.
Federal Electronics Elevates Hermosillo Facility with Advanced Mycronic 3D AOI System
08/12/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its new production line at its Hermosillo, Mexico facility with the addition of the Mycronic MYPro i50 Automated Optical Inspection (AOI) system.
Flex Delivers Advanced Power Management for Next-Generation NVIDIA AI Infrastructure
08/07/2025 | FlexFlex announced a new power shelf system to fast-track 800 VDC power architectures and support the growing demands of AI infrastructure and AI factories.
Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging
08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.